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The Boston Consultant Group (BCG) recently took a look at the impact that advanced packaging is having on the microelectronics chip ecosystem. Let’s take a look at some of the points that they make. Advanced packaging is replacing simple “scaling”, which had been the traditional way to achieve advancements in...
More than a few years ago, somewhere around 28nm, my working group was discussing the potential demise of “Moore’s Law”. The industry and international technology roadmap committee were struggling with hi-k metal gates, strain, FinFETs, and of course how lithography could keep shrinking. The designing and manufacturing of a system...
Will TSMC build advanced packaging facilities offshore? In IFTLE 490, we reported that TSMC is considering building an advanced IC packaging plant in the US. Now, from the Asia Times we learn in an article by Scott Foster, an analyst with Lightstream Research – Tokyo that in February, it was...
The semiconductor industry is currently undergoing the most radical change in its history. Many new applications such as artificial intelligence (AI), augmented/virtual reality, and autonomous driving require enormous computing power with processors optimized specifically for each application. At the same time, development cycles are becoming shorter, costs for new chip...
Fan-out wafer-level packaging (FOWLP) is an emerging type of high-density advanced packaging (HDAP) technology in the semiconductor industry that is rapidly gaining popularity in the market. But what exactly is FOWLP? Why do we need it? How do we take advantage of it? What limitations still need to be overcome?...
Consumer electronics designers continue to demand thinner and lighter packages while devices increase in functional complexity. The Fan-Out Wafer Level Package (FOWLP) platform has been gaining momentum with the advantages it offers in electrical performance, assembly process efficiency and low geometric profile. Different approaches of Package-on-Package (PoP) stacking in FOWLP...
You might recall that a few year’s back (October 2013, to be precise), 3D InCites’ regular blogger, Paul Werbaneth, had the opportunity to interview Dongkai Shangguan, then CEO of the National Center for Advanced Packaging (NCAP) in Wuxi, China, which he helped found along with nine investors. They talked about...
To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies. Leaders in the advanced packaging industry have identified new solutions enabling more and more functionalities to be integrated along with many devices in the same...
ST. FLORIAN, Austria, August 31, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company is experiencing strong demand for its automated 300mm polymer adhesive wafer bonding systems. Over the past 12 months, the company’s order...
Repeat Order for IQ Aligner Further Solidifies EVG’s Position as Leading Microlens Molding Solutions Provider for Wafer-level Camera Applications St. Florian, AUSTRIA, March 27, 2012 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Himax Technologies,...
