Search Results

Matches for your search: "fan-out wafer level packaging "

Nordson Electronics Solutions to Feature High-throughput Fluid Dispensing Technologies for Wafer-level and Panel-level Packaging at SEMICON Taiwan 2024

Aug 28, 2024

Visit booth #L0516 to discuss the latest developments in fluid dispensing for advanced semiconductor packaging. Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516. On display will be the ASYMTEK...

IFTLE 596: Advanced Packaging Reshaping the Chip Ecosystem

Jun 17, 2024

The Boston Consultant Group (BCG) recently took a look at the impact that advanced packaging is having on the microelectronics chip ecosystem. Let’s take a look at some of the points that they make. Advanced packaging is replacing simple “scaling”, which had been the traditional way to achieve advancements in...

Balancing Precision and Throughput in 3D Structures with Advanced Packaging and Motion Control

Apr 01, 2024

The relentless drive in the semiconductor industry to consistently deliver improved performance and power efficiency has traditionally led to increasingly smaller device geometries. However, these tiny footprint dimensions are starting to hit upon a process complexity and are becoming overly expensive to manufacture. Nobody can deny that keeping up with...

IFTLE 490: TSMC considers Packaging Facility in the US; EMIB Technology Advances

Jun 30, 2021

TSMC considers Packaging Facility in the US The Taipei Times is reporting (via Nikkei Japan) that TSMC is considering building an advanced IC packaging facility in the US. The potential US packaging plant would be equipped with the latest 3D stacking technologies. IC packaging is highly localized in Asia and...

2018 Outlook for Advanced Packaging Materials

Jan 12, 2018

Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor industry is also witnessing increasing investments in packaging, in terms of capabilities, capacity, and infrastructure from the assembly and packaging houses. All this attention on packaging is primarily driven by...

The Brighter Side of SEMICON West 2017

Jul 27, 2017

Generally, I avoid reading other journalists’ coverage of events I’ve attended until I’ve had a chance to finish my own coverage. But there it was in my inbox in a recent edition of Semiconductor Packaging News: “Five Takeaways from Semicon” by Semi Engineering’s Mark LePedus. I couldn’t resist. I had...

The Advanced Packaging Industry Reaches its Zenith

Apr 13, 2016

To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies. Leaders in the advanced packaging industry have identified new solutions enabling more and more functionalities to be integrated along with many devices in the same...

Advanced Packaging and 3D IC Market Driving Strong Growth for EV Group’s Automated 300mm Polymer Adhesive Wafer Bonding Systems

Aug 31, 2015

ST. FLORIAN, Austria, August 31, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company is experiencing strong demand for its automated 300mm polymer adhesive wafer bonding systems. Over the past 12 months, the company’s order...

SPTS: Sigma fxP PVD with Multi-Wafer Degas

Jun 26, 2015

SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It utilizes batch degas technology that can improve Rc whilst maintaining high throughputs, despite the outgassing challenges posed from the increasing use of organics, such as mold in Fan-Out WLP. Testimonial...

Himax Technologies Selects EV Group to Expand Production Capacity for Wafer-Level Optics

Mar 27, 2012

Repeat Order for IQ Aligner Further Solidifies EVG’s Position as Leading Microlens Molding Solutions Provider for Wafer-level Camera Applications St. Florian, AUSTRIA, March 27, 2012 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Himax Technologies,...