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Nordson Electronics Solutions to Feature High-throughput Fluid Dispensing Technologies for Wafer-level and Panel-level Packaging at SEMICON Taiwan 2024

Aug 28, 2024

Visit booth #L0516 to discuss the latest developments in fluid dispensing for advanced semiconductor packaging. Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516. On display will be the ASYMTEK...

IFTLE 490: TSMC considers Packaging Facility in the US; EMIB Technology Advances

Jun 30, 2021

TSMC considers Packaging Facility in the US The Taipei Times is reporting (via Nikkei Japan) that TSMC is considering building an advanced IC packaging facility in the US. The potential US packaging plant would be equipped with the latest 3D stacking technologies. IC packaging is highly localized in Asia and...

The IWLPC Fan-out PLP Smack Down

Nov 13, 2019

At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which was co-moderated by PLP technology expert, Tanja Braun, Fraunhofer IZM. Panelists were John Hunt, ASE; Joseph Dang, AT&S; Keith Best, Rudolph Technologies; Tim Olson, Deca Technologies. Fan-out PLP (FO PLP)...

Seen on the Scene at SEMICON Europa 2018

Nov 20, 2018

SEMICON Europa was an island in the vast sea of Electronica. It occupied one hall out of 18. But without that hall full of equipment, process, and material suppliers, the other 17 wouldn’t have any reason to exist. Think about that for a bit. There’s a reason “Semiconductors drive smart”...

2018 Outlook for Advanced Packaging Materials

Jan 12, 2018

Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor industry is also witnessing increasing investments in packaging, in terms of capabilities, capacity, and infrastructure from the assembly and packaging houses. All this attention on packaging is primarily driven by...

The Brighter Side of SEMICON West 2017

Jul 27, 2017

Generally, I avoid reading other journalists’ coverage of events I’ve attended until I’ve had a chance to finish my own coverage. But there it was in my inbox in a recent edition of Semiconductor Packaging News: “Five Takeaways from Semicon” by Semi Engineering’s Mark LePedus. I couldn’t resist. I had...

The Advancement of Device Packaging – A Resume on IMAPS DPC 2017

Apr 17, 2017

As part of the organizing committee, we believe this year’s IMAPS Device Packaging Conference really fulfilled what the announcement promised – the largest conference dedicated to the full spectrum of 3DIC and packaging, fan-out technologies and MEMS/sensors. We enjoyed 12% attendee growth over 2016, welcoming nearly 600 attendees from 20...

SPTS: Sigma fxP PVD with Multi-Wafer Degas

Jun 26, 2015

SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It utilizes batch degas technology that can improve Rc whilst maintaining high throughputs, despite the outgassing challenges posed from the increasing use of organics, such as mold in Fan-Out WLP. Testimonial...