Matches for your search: "fan-out wafer level packaging "
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device Packaging Conference (DPC), is scheduled from March 18 to 21 in Fountain Hills, AZ. Simultaneously, the Workshop on Advanced Packaging for Medical Microelectronics will take place at the WeKoPa Resort...
NanoCleave enables Laser Debonding on Silicon with Nanometer Precision In semiconductor manufacturing, 3D integration – the manufacturing, vertical assembly, and packaging of multiple different dies into a single package – is increasingly important in optimizing the power, performance, area, and cost (PPAC) metric in semiconductor design and manufacturing, as well...
SEMICON Europa is back! On the agenda? The latest innovations and smart applications powering the next wave of semiconductor industry growth, including leading-edge technologies such as artificial intelligence (AI), 5G and robotics. SEMICON Europa 2021, co-located with Productronica, will examine how the semiconductor industry can integrate environmental and social sustainability...
Sometimes, in the face of adversity, great things can be accomplished. In this case, the adversity was the COVID-19 crisis, and the great things accomplished were the goals of the Panel Level Packaging Consortium 2.0. In a recent article published by Fraunhofer IZM, Dr. Tanya Braun, group leader of the...
The semiconductor industry is currently undergoing the most radical change in its history. Many new applications such as artificial intelligence (AI), augmented/virtual reality, and autonomous driving require enormous computing power with processors optimized specifically for each application. At the same time, development cycles are becoming shorter, costs for new chip...
Picking up where we left off, Part two of this series celebrating advanced packaging innovation takes us from 2009-2019, beginning with the establishment of 3D InCites in 2009. The first conference I covered was the IMAPS Device Packaging Conference in 2009. We officially launched the first website in time for SEMICON...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry’s first process technology platform for wafer-level heterogeneous integration of gallium arsenide (GaAs) on...
2015 overall was a mixed year for the materials sector in the electronics market, with a general slowdown in PC-related segments offset by continued growth in mobile smart phones and other handheld devices despite industry growth flattening out late in 2015. In 2016, market forecasts indicate some improved growth and...
The 65th annual Electronics Technology Components Conference (ECTC 2015) logged record numbers (over 1500 attendees, 20% increase over last year) as the entire semiconductor industry recognizes (finally) that there is indeed money to be made in the advanced packaging sector. The flip chip and wafer level packaging sessions were full to...
SEMICON West, San Francisco, Calif., July 10, 2012 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its GEMINI® Automated Wafer Bonding System has become the first product to pass a systematic, rigorous Equipment Maturity Assessment...
