Matches for your search: "fan-out wafer level packaging "
How A Collaborative Partnership Is Accelerating PLP Innovation Panel-level advanced packaging technologies have been in development for more than a decade. They began as a way to reduce costs and improve yields for fan-out wafer-level applications. Smartphone applications – particularly fingerprint sensors – promised the volumes that would make the...
I have spent a considerable amount of time covering the technology associated with the front-, and back end of-the-line. So for me, it is remarkable to see the growth in advanced packaging and how the interest in packaging technology seems to be overshadowing the FEOL transition to gate all around...
Managing the System-level Netlist and Its Exceptions in 3D ICs 3D IC is a growing semiconductor technology that pushes the limits of single-die designs. Splitting a large die into multiple smaller dies has proven to provide an acceptable yield and reify the era of chiplets, which has elevated IP reuse...
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, July 10-12, 2023, in Washington, DC. This workshop will bring Government agencies, the DIB (Defense Industrial Base) and Advanced Packaging and Assembly providers together...
Technology enables state-of-the-art onshore advanced packaging foundry services KISSIMMEE, Fla. and TEMPE, Ariz. – October 12, 2021 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner and Deca Technologies (Deca), a leading provider of advanced electronic interconnect technology, today announced an agreement for Deca’s second generation M-Series™ fan-out wafer-level packaging...
Deca Technologies is pleased to announce that it has reached an agreement with nepes Corporation (nepes) whereby nepes will expand its geographic footprint and manufacturing capabilities by taking over the operations of Deca Technologies’ Philippines manufacturing facility. The investment will permit the expansion of the WLCSP capacity already in mass...
Heterogeneous Integration spurs demand for 3D backend solutions Julian Ho reported in the Jan 10th issue of Digitimes that heterogeneous integration of diverse semiconductor components to support 5G, AI, automotive electronics, and IoT applications is gaining significant momentum, driving demand for system-in-package (SiP) and system-on-3D package (So3D) processes and boosting the...
Is Moore’s Law dead or not? It depends on your perspective. Last week at ECTC 2016, Rozalia Beica, Dow Electronic Materials, gathered a prestigious group of senior executives from the world’s leading microelectronics research institutes to discuss Life after Moore’s Law. Panelists included Marie-Noelle Semeria, CEA-Leti; Dim Lee Kwong, IME;...
More than 25 years ago, Professor Rao Tummala founded Georgia Tech’s Package Research Center. However, his vision that advanced IC packaging technology would “graduate” soon and play a major role in the semiconductor industry didn’t come true for a long time. About a decade ago, the first generation of advanced...
New wafer bonder from EVG enables 3-5x throughput improvement for breakthrough cost-of-ownership performance SEMICON EUROPA, Dresden, Germany, October 19, 2010 – EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest...
