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How A Collaborative Partnership Is Accelerating PLP Innovation Panel-level advanced packaging technologies have been in development for more than a decade. They began as a way to reduce costs and improve yields for fan-out wafer-level applications. Smartphone applications – particularly fingerprint sensors – promised the volumes that would make the...
I have spent a considerable amount of time covering the technology associated with the front-, and back end of-the-line. So for me, it is remarkable to see the growth in advanced packaging and how the interest in packaging technology seems to be overshadowing the FEOL transition to gate all around...
Managing the System-level Netlist and Its Exceptions in 3D ICs 3D IC is a growing semiconductor technology that pushes the limits of single-die designs. Splitting a large die into multiple smaller dies has proven to provide an acceptable yield and reify the era of chiplets, which has elevated IP reuse...
Technology enables state-of-the-art onshore advanced packaging foundry services KISSIMMEE, Fla. and TEMPE, Ariz. – October 12, 2021 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner and Deca Technologies (Deca), a leading provider of advanced electronic interconnect technology, today announced an agreement for Deca’s second generation M-Series™ fan-out wafer-level packaging...
Deca Technologies is pleased to announce that it has reached an agreement with nepes Corporation (nepes) whereby nepes will expand its geographic footprint and manufacturing capabilities by taking over the operations of Deca Technologies’ Philippines manufacturing facility. The investment will permit the expansion of the WLCSP capacity already in mass...
Heterogeneous Integration spurs demand for 3D backend solutions Julian Ho reported in the Jan 10th issue of Digitimes that heterogeneous integration of diverse semiconductor components to support 5G, AI, automotive electronics, and IoT applications is gaining significant momentum, driving demand for system-in-package (SiP) and system-on-3D package (So3D) processes and boosting the...
The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as seven nominees in some fields (supplier of the year), and tallied just over 17,529 votes in total! We also saw a considerable increase in nominees using social media to promote...
As you all may know, in most fan-out wafer level packages (FOWLP) such as embedded wafer level ball grid array (eWLB) by Infineon and STATS ChipPAC, and TSMC’s integrated fan out (InFO), the chip(s) are embedded in epoxy molding compound (EMC). Additionally, in some fan-out panel-level packaging (FOPLP) such as those being...
More than 25 years ago, Professor Rao Tummala founded Georgia Tech’s Package Research Center. However, his vision that advanced IC packaging technology would “graduate” soon and play a major role in the semiconductor industry didn’t come true for a long time. About a decade ago, the first generation of advanced...
Device of the Year InFO PoP – TSMC A device architecture that was developed and qualified for high volume production in record time. The announcement of its use in the A10 processor in September 2016 paved the way for fan-out applications to be used in mobile products in high volumes....
