Matches for your search: "fan-out wafer level packaging "
Papers will highlight heterogeneous integration solutions such as hybrid bonding, maskless lithography, and layer transfer technology for advanced packaging applications. EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration enabled by its...
Amkor Technology’s announcement to build a high-volume facility in the US, as well as the award winner announcements for the IBAS RESHAPE program, indicate that advanced packaging is indeed coming onshore in the US. Let’s take a closer look. Amkor Announces US Advanced Packaging and Test Facility Amkor Technology is...
This detailed blog covers how wafers are manufactured and processed, what makes a perfect wafer, and which surface metrology approaches can be used for quality assurance. First… the manufacturing process Microelectronic components and semiconductors are manufactured on round thin discs, referred to as wafers. Wafers can be made of various...
SEMICON Europa is back! On the agenda? The latest innovations and smart applications powering the next wave of semiconductor industry growth, including leading-edge technologies such as artificial intelligence (AI), 5G and robotics. SEMICON Europa 2021, co-located with Productronica, will examine how the semiconductor industry can integrate environmental and social sustainability...
Technology enables state-of-the-art onshore advanced packaging foundry services KISSIMMEE, Fla. and TEMPE, Ariz. – October 12, 2021 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner and Deca Technologies (Deca), a leading provider of advanced electronic interconnect technology, today announced an agreement for Deca’s second generation M-Series™ fan-out wafer-level packaging...
Temporary wafer bonding processes were initially developed for enabling three-dimensional (3D) stacked integrated circuits (ICs). For example, dies can be stacked on top of each other using die-to-wafer stacking to create 3D IC stacks. Through-Si vias (TSVs) and microbumps are used to interconnect the finished dies. These techniques require the...
Deca Technologies is pleased to announce that it has reached an agreement with nepes Corporation (nepes) whereby nepes will expand its geographic footprint and manufacturing capabilities by taking over the operations of Deca Technologies’ Philippines manufacturing facility. The investment will permit the expansion of the WLCSP capacity already in mass...
The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as seven nominees in some fields (supplier of the year), and tallied just over 17,529 votes in total! We also saw a considerable increase in nominees using social media to promote...
Is Moore’s Law dead or not? It depends on your perspective. Last week at ECTC 2016, Rozalia Beica, Dow Electronic Materials, gathered a prestigious group of senior executives from the world’s leading microelectronics research institutes to discuss Life after Moore’s Law. Panelists included Marie-Noelle Semeria, CEA-Leti; Dim Lee Kwong, IME;...
Device of the Year InFO PoP – TSMC A device architecture that was developed and qualified for high volume production in record time. The announcement of its use in the A10 processor in September 2016 paved the way for fan-out applications to be used in mobile products in high volumes....
