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Papers will highlight heterogeneous integration solutions such as hybrid bonding, maskless lithography, and layer transfer technology for advanced packaging applications. EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration enabled by its...
This detailed blog covers how wafers are manufactured and processed, what makes a perfect wafer, and which surface metrology approaches can be used for quality assurance. First… the manufacturing process Microelectronic components and semiconductors are manufactured on round thin discs, referred to as wafers. Wafers can be made of various...
Temporary wafer bonding processes were initially developed for enabling three-dimensional (3D) stacked integrated circuits (ICs). For example, dies can be stacked on top of each other using die-to-wafer stacking to create 3D IC stacks. Through-Si vias (TSVs) and microbumps are used to interconnect the finished dies. These techniques require the...
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan-out WLPs (FO-WLPs). Despite lower growth for smartphones, growth continues as the number of WLPs per handset increase. WLPs are increasingly adopted in tablets, and wearable devices such as smartwatches, fitness bands, and virtual reality headsets. Fan-in...
The semiconductor industry’s trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and smartphones are giving way to functional applications that are plotting the semiconductor industry’s future course. Internet of Things (IoT), the automotive market, 5G connectivity, augmented and virtual reality (AR/VR), and artificial intelligence...
The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as seven nominees in some fields (supplier of the year), and tallied just over 17,529 votes in total! We also saw a considerable increase in nominees using social media to promote...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation laser debonding solution, which enables high-throughput, low-cost-of-ownership (CoO) room-temperature debonding for ultra-thin and stacked fan-out packages. Designed as a module for integration in the company’s benchmark EVG®850...
As you all may know, in most fan-out wafer level packages (FOWLP) such as embedded wafer level ball grid array (eWLB) by Infineon and STATS ChipPAC, and TSMC’s integrated fan out (InFO), the chip(s) are embedded in epoxy molding compound (EMC). Additionally, in some fan-out panel-level packaging (FOPLP) such as those being...
In its fourth edition and with a new name, the European 3D Summit (formerly the European 3D TSV Summit) reflected the shift from R&D to the real business of 3D integration and advanced packaging, and highlighted the significant growth this market space has undergone in the past year. It has...
Device of the Year InFO PoP – TSMC A device architecture that was developed and qualified for high volume production in record time. The announcement of its use in the A10 processor in September 2016 paved the way for fan-out applications to be used in mobile products in high volumes....
