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Papers will highlight heterogeneous integration solutions such as hybrid bonding, maskless lithography, and layer transfer technology for advanced packaging applications. EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration enabled by its...
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, July 10-12, 2023, in Washington, DC. This workshop will bring Government agencies, the DIB (Defense Industrial Base) and Advanced Packaging and Assembly providers together...
This detailed blog covers how wafers are manufactured and processed, what makes a perfect wafer, and which surface metrology approaches can be used for quality assurance. First… the manufacturing process Microelectronic components and semiconductors are manufactured on round thin discs, referred to as wafers. Wafers can be made of various...
Temporary wafer bonding processes were initially developed for enabling three-dimensional (3D) stacked integrated circuits (ICs). For example, dies can be stacked on top of each other using die-to-wafer stacking to create 3D IC stacks. Through-Si vias (TSVs) and microbumps are used to interconnect the finished dies. These techniques require the...
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan-out WLPs (FO-WLPs). Despite lower growth for smartphones, growth continues as the number of WLPs per handset increase. WLPs are increasingly adopted in tablets, and wearable devices such as smartwatches, fitness bands, and virtual reality headsets. Fan-in...
“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly, and Substrates at Yole Korea, part of Yole Développement (Yole).“The market grew by 21.6% year-to-year to reach a record of almost US$412 billion.” Under this dynamic context, the advanced packaging industry is playing a key role,...
The semiconductor industry’s trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and smartphones are giving way to functional applications that are plotting the semiconductor industry’s future course. Internet of Things (IoT), the automotive market, 5G connectivity, augmented and virtual reality (AR/VR), and artificial intelligence...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation laser debonding solution, which enables high-throughput, low-cost-of-ownership (CoO) room-temperature debonding for ultra-thin and stacked fan-out packages. Designed as a module for integration in the company’s benchmark EVG®850...
In its fourth edition and with a new name, the European 3D Summit (formerly the European 3D TSV Summit) reflected the shift from R&D to the real business of 3D integration and advanced packaging, and highlighted the significant growth this market space has undergone in the past year. It has...
New wafer bonder from EVG enables 3-5x throughput improvement for breakthrough cost-of-ownership performance SEMICON EUROPA, Dresden, Germany, October 19, 2010 – EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest...
