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An inside look at how ASU, local governments, and private sector companies are working together to make Arizona a hub for advanced packaging innovation. The year 2022 was monumental for the semiconductor industry. That year, the Biden-Harris administration committed to making the U.S. a world leader in semiconductor manufacturing by...
Amkor Technology’s announcement to build a high-volume facility in the US, as well as the award winner announcements for the IBAS RESHAPE program, indicate that advanced packaging is indeed coming onshore in the US. Let’s take a closer look. Amkor Announces US Advanced Packaging and Test Facility Amkor Technology is...
Papers to highlight breakthrough capabilities of EVG’s hybrid bonding and metrology solutions for heterogeneous integration, and NIL solutions for meta-optics and AR waveguide manufacturing ST. FLORIAN, Austria, August 29, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced...
Seed layer deposition is one of the most critical process steps in manufacturing vertical and horizontal interconnects. At the panel level, seed layer deposition must deliver high-performance degas, etch, and sputter deposition processes as well managed substrate temperature throughout the whole process to ensure low contact resistance (Rc) and excellent...
New ECP ap capability controls the wafer-level electric field to deliver better uniformity within wafer and within die while achieving higher throughputs FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP)...
“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly, and Substrates at Yole Korea, part of Yole Développement (Yole).“The market grew by 21.6% year-to-year to reach a record of almost US$412 billion.” Under this dynamic context, the advanced packaging industry is playing a key role,...
Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts from all over the world are deeply involved in the development of innovative solutions to answer to the market demand dominated by megatrends. “Megatrend will probably be the keyword for...
Winter 2018, and Korea is at the center of the world in both sports and in electronics. Sports, of course, because of PyeongChang, host city for the 23rd Olympic Winter Games, with participants ranging from Eritrea to Tonga, along with the usual cold-weather-country (Norway, Canada, Sweden, etc.) players who showed...
In the fourth installment of the series “Convergence on the Big Five,” we compared conventional SiP with advanced system-in-package (SiP), which is focused on laminate-based approaches, and is available and in production today. Advanced SiP packaging has been a game changer in addressing system-level integration and providing the lowest form...
In last week’s coverage of the Known Good Die Symposium, I talked about the notion of shifting focus from Known Good Die to Probably Good Die. It got me to thinking how by simply changing vernacular that we use, we can alter perspective and thereby affect a complete paradigm shift...
