Matches for your search: "fan-out wafer level packaging "
When the United States and Europe looked to re-shore semiconductor technology, the primary focus was restoring leading-edge manufacturing and creating more resilient supply chains throughout the ecosystem. Eventually, it emerged that nearly all of the leading-edge advanced packaging took place in Asia, and there was minimal packaging capability in either...
The system delivers superior uniformity, enabling performance and cost efficiencies for next-generation chip packaging ACM Research, Inc., a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced its new Panel Electrochemical Plating (Ultra ECP ap-p) tool designed for fan-out panel-level packaging (FOPLP). This new tool employs...
SEMICON Europa 2023, co-located with productronica in Munich, Germany makes for one of the strongest single events for electronics manufacturing in Europe. Together, SEMICON Europa and productronica showcase the entire spectrum of technologies and solutions for the entire semiconductor and electronics manufacturing industries, reflecting the rapid pace of technological development...
This week, we finish our look at papers presented during the IMAPS CHIPCon Conference held in July, 2023, where we focus on North American advanced packaging and new ABF materials. We also applaud the appointment of Dr. Suby Iyer to head up NAPMP, and Dev Palmer’s promotion from within DARPA....
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with a focus on PACKAGING TECHNOLOGIES ENABLING THE NEW NORMAL. The technical program will span three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial,...
“Changes in the semiconductor supply chain and shifting business models, as well as uncertainty related to US-china trade, creates a growing number of huge opportunities for some while posing a threat to others,” comments Emilie Jolivet, Division Director, Semiconductor & Software at Yole Développement (Yole). “At Yole, we are continuously...
Rolla, Missouri – Sept. 4, 2018 – Brewer Science, Inc. today from SEMICON Taiwan introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address...
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan-out WLP (FO-WLP). Driven by demand for thin, low-profile packages in smartphones, tablets, and wearable devices such as smart watches, fitness bands, and virtual reality headsets, fan-in WLPs...
The 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) conference is one of the biggest (if not THE biggest) event focused exclusively on the 3D IC family of technologies. The December 2016 event was held even closer to San Francisco airport than in previous years. From the lobby of...
Intent in fostering collaborative innovation across the supply chain, Yole Développement and the National Center for Advanced Packaging (NCAP) teamed up to present the first Advanced Packaging and Integration Technology Symposium, August 28, 2014, in Wuxi, China. The one-day event attracted international participation from 48 organizations, with strong high level...
