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SEMICON West 2023 is taking aim at Building a Path Forward with a reimagined exhibition and conference as industry experts and visionaries gather July 11-13 at the Moscone Center in San Francisco. The event focuses on key challenges affecting the global microelectronics industry which include Supply Chain Disruptions, Climate Change, and Talent...
Ultra SFP ap Provides Environmentally Friendlier Alternative to Conventional CMP for TSV and Fan-Out Wafer-Level Packaging Processes Fremont, California – March 18, 2020 – ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today introduced the Ultra SFP ap tool...
Deca Technologies has confirmed that its M-Series™ fan-out wafer-level packaging (FOWLP) technology has been adopted by Qualcomm for power management integrated circuit (PMIC) devices in Samsung’s S10, the Xiaomi Mi 9 and LG G8 smartphones. (Figure 1). And in other news, advanced packaging was the Cinderella Story at Hot Chips...
System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling path. In this article, we will unravel the STCO principle, open up the 3D technology toolbox and bring up two promising cases: logic on memory, and backside power delivery. After DTCO...
As its name implies, the International Wafer Level Packaging Conference (IWLPC) initially covered wafer-level packaging (WLP) technologies. As all conferences do, it soon expanded its scope to cover basically all advanced packaging topics including WLP, fan-out wafer-level packaging (FOWLP), 2.5D/3D, and advanced manufacturing and test, etc. Statistics from this year’s...
SEMI did a great job at SEMICON West 2016 organizing a bursting-at-the-seams amount of technical content presented on the show floor, content that included (pleasant surprise) a full track devoted to advanced packaging topics. Definitely not business as usual. The distinction between where fab processes end and where packaging processes...
“The sum is greater than the whole of its parts.” ~ Aristotle (and Bill Chen) While the technology tracks offered the latest developments in interposer and 3D IC processes, fan-out, wafer-level packaging, flip chip, MEMs, sensors and more, System-in-package (SiP) was the big story of the 2016 MAPS Device Packaging...
In its fourth edition and with a new name, the European 3D Summit (formerly the European 3D TSV Summit) reflected the shift from R&D to the real business of 3D integration and advanced packaging, and highlighted the significant growth this market space has undergone in the past year. It has...
Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of flip chip technology for LED and CMOS Image Sensors (CIS) applications, the flip chip market is expanding. Under this context, more and more industrial companies including OSATs, IDMs IC foundries and...
Intent in fostering collaborative innovation across the supply chain, Yole Développement and the National Center for Advanced Packaging (NCAP) teamed up to present the first Advanced Packaging and Integration Technology Symposium, August 28, 2014, in Wuxi, China. The one-day event attracted international participation from 48 organizations, with strong high level...
