Matches for your search: "fan-out wafer level packaging "
See this unique nozzle cleaning system and speak with our experts at IPC APEX booth 3200 Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, announced its latest technology innovation for conformal coating systems, the ASYMTEK Select Coat® SL-1040 Ultrasonic Cleaning Station (patent pending) to keep nozzles and...
Perhaps more than at any point in the history of the semiconductor industry, the manufacturing and design supply chain is in the world’s spotlight, thanks largely to the recent period of international trade tension. The national agendas of governments representing the world’s largest economies are prioritizing IP protection along with...
This week we continue our look presentations from SEMICON Europa’s Advanced Packaging Conference. Intel’s Reliability Test Beth Keser’s group at Intel Germany discussed their “product-on-board” reliability test for 0.3mm WLCSPs. The existing JEDEC/IPC board-level methodology tests are fine for traditional packaging solutions for non-extreme low K dielectric (ELK) fab nodes....
Last week, I had a whirlwind trip to Grenoble, France: 3 days, 2 summits, and 1 supercool paragliding festival, Coupe Icare, on the side – all filled with “Aha!” moments. Ironically, the paragliding event I attended on Saturday drove home the point of the most stand-out talk from the week:...
The technologies are ready, the target high volume applications for 3D IC manufacturing have been identified, and now it’s about convincing system architects there’s more to gain from designing in 2.5D and 3D ICs than there is to lose. At last week’s European 3D TSV Summit (January 21-22), two European...
All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM Institute, has begun pilot-line production of 3D semiconductor devices using a single-wafer, multi-chamber AltaCVD 300 system from Altatech Semiconductor S.A. At Fraunhofer IZM-ASSID’s 970-square-meter cleanroom facility in Dresden, Altatech’s
