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ERS electronic Appoints Joshua Zhou as Vice President

ERS electronic, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is appointing Joshua Zhou as Vice President. Zhou joined the company as Sales and Marketing Director in 2018 when ERS opened its China sales office in Shanghai. Joshua has more than twenty years of experience in...

Lessons Learned From the Trenches of 3D IC Manufacturing for Sensor Applications

The technologies are ready, the target high volume  applications for 3D IC manufacturing have been identified, and now it’s about convincing system architects there’s more to gain from designing in 2.5D and 3D ICs than there is to lose. At last week’s European 3D TSV Summit (January 21-22), two European...

IWLPC 3D Thursday: The Panel

It’s been a whirlwind of conferences these past few weeks, and as a result, I have attended FOUR panel discussions on 2.5D and 3D related topics. (I already wrote about the 3D Test Workshop Panel – 3D Buzz Hype or Reality. It’s stirred quite a discussion.) The day before I...

Altatech Semiconductor’s 300 mm CVD System Being Used in 3D IC Pilot Production at ASSID

All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM Institute, has begun pilot-line production of 3D semiconductor devices using a single-wafer, multi-chamber AltaCVD 300 system from Altatech Semiconductor S.A. At Fraunhofer IZM-ASSID’s 970-square-meter cleanroom facility in Dresden, Altatech’s

Following the BrightSpots 3D IC Forum

Day One: I'm not sure if it’s because it was the Monday after a U.S. holiday weekend, or just a Monday, but things seemed a bit slow out of the gate. I posted the first questions and waited. Paul Lindner of EV Group jumped right in on a positive...