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The 2024 SEMI Europe 3D & Systems Summit takes place on June 12-14 at the Hilton Hotel in Dresden, Germany. Aptly themed Heterogeneous Systems for the Intelligently Connected Era, this conference will focus on component integration for powering the next wave of technological innovation. From artificial intelligence, sensor data processing,...
Ultra Fn A Furnace Tool Shipped to China-Based Foundry Customer FREMONT, Calif., Sept. 27, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it has expanded its 300mm Ultra Fn furnace...
Last week, I had a whirlwind trip to Grenoble, France: 3 days, 2 summits, and 1 supercool paragliding festival, Coupe Icare, on the side – all filled with “Aha!” moments. Ironically, the paragliding event I attended on Saturday drove home the point of the most stand-out talk from the week:...
Like the previous 10 years, RTI International held the 11th 3D-IC focused conference in early December. Instead of the usual two and a half days, this year it spanned 3 days, because it also offered a 4-hour session about 3D design challenges and solutions available from foundries, EDA and IP...
In the last 40 years, the Principality of Liechtenstein has evolved from a purely agricultural state into one of the most highly industrialized countries in the world. But some how it has managed to keep its Alpine charm. That’s why at first glance, the city of Balzers, complete with its...
The technologies are ready, the target high volume applications for 3D IC manufacturing have been identified, and now it’s about convincing system architects there’s more to gain from designing in 2.5D and 3D ICs than there is to lose. At last week’s European 3D TSV Summit (January 21-22), two European...
Outsourced Semiconductor Assembly and Test (OSAT) provider, STATS ChipPAC Ltd., has announced qualification of its 300mm middle-end-of-line (MEOL) manufacturing operation for Through Silicon Via (TSV) capabilities, and will transition to low volume manufacturing. STATS ChipPAC says it is firmly engaged with multiple strategic customers on TSV development programs that support the...
The 3D-IC LinkedIn Group announced today that it has reached more than 1,100 members. The discussion forum for 3D Integrated Circuits (3D-ICs) was established in July of 2011. The increasing level of interest shown by the industry in the past few months makes this LinkedIn Group a good opportunity for...
ANSYS subsidiary Apache Design, Inc. today introduced RedHawk(TM)-3DX to meet the power, performance and price demands of low-power mobile, high-performance computing, consumer and automotive electronics. This fourth-generation power sign-off solution delivers greater accuracy, capacity and usability for full-chip dynamic power and reliability simulation to manage power consumption and improve power
In an understated research lab and recently upgraded demo facility located just outside Paris in Massy, France, Alchimer scientists are working diligently to prove the readiness of an elegant and innovative electrochemical-based process for the growth of nanometric thin films of various types on both conducting and semiconducting surfaces....
