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Calibre 3DThermal delivers complete chip and package-inward thermal analysis software for 3D-ICs, addressing critical design and verification challenges from early-stage chip and 3D assembly exploration to design signoff New offering integrates with Siemens’ advanced design tools to provide a robust platform that captures and analyzes thermal data throughout the design...
This year’s IMAPS keynotes focused on advancements in heterogeneous integration (HI) technologies and chiplet architectures enabled by HI, driven by the needs of high-performance computing, AI, and automotive applications. While it feels for some of us that we’ve been in the thick of advanced packaging, HI, and the More than...
The last month has been an interesting time in the world of sustainability. First, the SEC released its estimates on costs for reporting on climate change, and a document for review on suggested reporting standards. The S&P Dow Jones index removed Tesla from its top 10 ESG index, The Davos...
Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that it has acquired Semiconductor Process Equipment Corporation (SPEC ) of Valencia, California for an undisclosed amount. The companies had announced a strategic partnership agreement in June. The...
Advances in Edge Computing Must Innovate for Autonomous Vehicles to Realize Their Potential Large numbers of sensors, massive amounts of data, ever-increasing computing power, real-time operation, and security concerns required for autonomous vehicles are driving the core of computation from the cloud to the edge of the network. Autonomous vehicles...
In addition to Francoise’s post about technology megatrends here, below is part one of my perspective, mostly about the SEMICON West keynotes. Design and Manufacturing Are Finally Combining From July 9-11, many IC manufacturing experts came together at SEMICON West in San Francisco’s very nicely renovated Moscone Center. As an industry...
On Monday, April 16, 2018, SEMI, the industry association representing the global electronics manufacturing supply chain, and the Electronic System Design (ESD) Alliance, representing the design community, announced a strategic partnership. On Tuesday I had a very informative conference call with Bettina Weiss, VP Business Development at SEMI and Bob...
Shortly before the summer break started, I attended a number of industry conferences: MEPTEC, ECTC, DAC, MEMS & Sensors, ASME and SEMICON West. At all of them, I clearly noticed that our industry is looking beyond “Moore’s Law” to advanced IC packaging, multi-die ICs, and system scaling. However, at every...
A few weeks ago, San Francisco’s Moscone Center hosted the Design Automation Conference (DAC 2015), with many EDA experts and their customers focused on how to design the new wave of 10nm chips, this year and next. Last week the Moscone Center was buzzing again, this time with material suppliers,...
What is heterogeneous integration, and is it my friend, or is it my foe? Why does it seem everywhere one looks, heterointegration is standing up and being counted right now, in mid-2015? And what kind of doors is heterogeneous integration opening for microelectronic technologies beyond, complementary to, or in competition...
