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Calibre 3DThermal delivers complete chip and package-inward thermal analysis software for 3D-ICs, addressing critical design and verification challenges from early-stage chip and 3D assembly exploration to design signoff New offering integrates with Siemens’ advanced design tools to provide a robust platform that captures and analyzes thermal data throughout the design...
COP 27 was held in the second and third week of November 2022. In the media, there was news of calls to accountability for promises made at COP 26, for which richer nations are still lagging. These included a $100 billion fund to assist smaller countries that are significantly impacted...
The last month has been an interesting time in the world of sustainability. First, the SEC released its estimates on costs for reporting on climate change, and a document for review on suggested reporting standards. The S&P Dow Jones index removed Tesla from its top 10 ESG index, The Davos...
In the ESD Alliance line-up of Fall 2021 events, next is a webinar on export compliance, a topic that affects all companies in the 3D InCites community and semiconductor industry, not just the system design ecosystem as the title implies. The “Understanding Export Regulations Affecting the Electronic System Design Ecosystem”...
Shortly before the summer break started, I attended a number of industry conferences: MEPTEC, ECTC, DAC, MEMS & Sensors, ASME and SEMICON West. At all of them, I clearly noticed that our industry is looking beyond “Moore’s Law” to advanced IC packaging, multi-die ICs, and system scaling. However, at every...
In the past, the Design Automation Conference was known to me and many of my colleagues as the annual event that focused on IC design tools, flows, and methodologies. EDA tools vendors and users got together in the previous millennium to discuss what to do next in a rapidly growing market...
A few weeks ago, San Francisco’s Moscone Center hosted the Design Automation Conference (DAC 2015), with many EDA experts and their customers focused on how to design the new wave of 10nm chips, this year and next. Last week the Moscone Center was buzzing again, this time with material suppliers,...
What is heterogeneous integration, and is it my friend, or is it my foe? Why does it seem everywhere one looks, heterointegration is standing up and being counted right now, in mid-2015? And what kind of doors is heterogeneous integration opening for microelectronic technologies beyond, complementary to, or in competition...
A major concern in 3D IC designs is ensuring reliability and quality. Specifically, there is a growing need for design verification flows that can determine the cross-layer implications of the stresses caused by through silicon vias (TSVs) and chip-package interaction (CPI) induced mechanical stresses. Because 3D IC stacks have limited...
DesignCon’s 2015‘s tag-line “where the chip meets the board”, was a very appropriate message, and summarized in a few words a major trend in our semiconductor- and electronic systems industry: The increasing need for holistic planning as well as modeling of building blocks, not only for better up- and down-stream...
