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By Juliana Panchenko and Frank Windrich, Fraunhofer IZM-ASSID 15 years ago, Fraunhofer established the “White House of microelectronics packaging”— a leading-edge research center for 3D integration and advanced wafer-level packaging on 200/300mm wafer sizes. It was founded based on visionary ideas in the field of microelectronic packaging from the former...
Utilizes vacuum technology and IPA drying to enhance cleaning efficiency for cost-effective fan-out panel-level packaging ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced the Ultra C vac-p flux cleaning tool for fan-out panel-level packaging (FOPLP). Utilizing...
SEMICON West 2023 is taking aim at Building a Path Forward with a reimagined exhibition and conference as industry experts and visionaries gather July 11-13 at the Moscone Center in San Francisco. The event focuses on key challenges affecting the global microelectronics industry which include Supply Chain Disruptions, Climate Change, and Talent...
Ultra SFP ap Provides Environmentally Friendlier Alternative to Conventional CMP for TSV and Fan-Out Wafer-Level Packaging Processes Fremont, California – March 18, 2020 – ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today introduced the Ultra SFP ap tool...
Deca Technologies has confirmed that its M-Series™ fan-out wafer-level packaging (FOWLP) technology has been adopted by Qualcomm for power management integrated circuit (PMIC) devices in Samsung’s S10, the Xiaomi Mi 9 and LG G8 smartphones. (Figure 1). And in other news, advanced packaging was the Cinderella Story at Hot Chips...
System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling path. In this article, we will unravel the STCO principle, open up the 3D technology toolbox and bring up two promising cases: logic on memory, and backside power delivery. After DTCO...
In this IFTLE post, we continue our look at presentations from the 2018 EPTC Conference… Ultratech / IMEC / JSR – 1µm RDL Ultratech, IMEC and JSR discussed “One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging using a Photosensitive Dielectric Material”. This study compared the creation of 1.0μm RDL...
As its name implies, the International Wafer Level Packaging Conference (IWLPC) initially covered wafer-level packaging (WLP) technologies. As all conferences do, it soon expanded its scope to cover basically all advanced packaging topics including WLP, fan-out wafer-level packaging (FOWLP), 2.5D/3D, and advanced manufacturing and test, etc. Statistics from this year’s...
“The sum is greater than the whole of its parts.” ~ Aristotle (and Bill Chen) While the technology tracks offered the latest developments in interposer and 3D IC processes, fan-out, wafer-level packaging, flip chip, MEMs, sensors and more, System-in-package (SiP) was the big story of the 2016 MAPS Device Packaging...
The mobile sector is driving production and market growth; however a new market driver, the Internet of Things (IoT) is on the horizon and is expected to have a significant impact on the advanced packaging industry. “IoT-driven semiconductor industry consolidation is reflecting into a highly dynamic advanced packaging landscape,” says Andrej Ivankovic,...
