Matches for your search: "fan-out wafer level packaging "
COP 27 was held in the second and third week of November 2022. In the media, there was news of calls to accountability for promises made at COP 26, for which richer nations are still lagging. These included a $100 billion fund to assist smaller countries that are significantly impacted...
HALF MOON BAY, Calif. — April 5, 2022 — SEMI Industry Strategy Symposium (ISS) 2022 opened yesterday with the theme Semiconductors Leading a Transforming World to highlight semiconductor industry growth opportunities and challenges. The annual three-day conference of C-level and senior industry executives gives a comprehensive outlook of global electronics...
Addressing sustainability issues is a hot topic in the semiconductor industry, especially since Bloomberg highlighted that the industry’s carbon footprint is growing at a rapid clip while the auto industry’s carbon footprint has declined over the same period. However, the article only calls out GM as the automaker of reference....
In the ESD Alliance line-up of Fall 2021 events, next is a webinar on export compliance, a topic that affects all companies in the 3D InCites community and semiconductor industry, not just the system design ecosystem as the title implies. The “Understanding Export Regulations Affecting the Electronic System Design Ecosystem”...
If you love, like me, to work on the bleeding edge of technology, you will find that your personal success depends very much on the team around you, your company, even the entire supply chain. The organizers of this workshop – AMD’s Michael Alonso, Advantest’s Dave Armstrong, and MEPTEC’s Ira...
In the past, the Design Automation Conference was known to me and many of my colleagues as the annual event that focused on IC design tools, flows, and methodologies. EDA tools vendors and users got together in the previous millennium to discuss what to do next in a rapidly growing market...
A major concern in 3D IC designs is ensuring reliability and quality. Specifically, there is a growing need for design verification flows that can determine the cross-layer implications of the stresses caused by through silicon vias (TSVs) and chip-package interaction (CPI) induced mechanical stresses. Because 3D IC stacks have limited...
DesignCon’s 2015‘s tag-line “where the chip meets the board”, was a very appropriate message, and summarized in a few words a major trend in our semiconductor- and electronic systems industry: The increasing need for holistic planning as well as modeling of building blocks, not only for better up- and down-stream...
Ever since SEMICON West 2014, I’ve been seeing a lot of coverage of the 2.5D and 3D adoption question on Semiconductor Engineering, an industry content platform that covers the spectrum of semiconductor topics, and occasionally covers 2.5D and 3D, providing the perspective of chip architects, engineers, end users, industry organizations...
Good news! At last week’s GSA 3D IC Packaging Working Group Meeting, July 23, 2014, Jan Vardaman uttered the words I’ve been waiting to hear her say for quite some time. “Memory stacks with TSVs are here!” Vardaman cited three companies actively involved in new memory architectures, all of which...
