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At SEMICON Europa 2023, we heard more good news about 3D heterogeneous Integration from speakers at the CEO Summit and the Advanced Packaging Conference. Not only has it become the champion for the continuation of Moore’s Law scaling, but it also allows us to deliver on power performance area and...
IFTLE has been updating our readers on the chiplet market and the technology since I served as subject matter expert (SME) for DARPA’s Dan Green who gets credit for developing the CHIPS program (Common Heterogeneous Integration and IP Reuse Strategies) in 2017. At that time the average packaging engineer couldn’t...
With $52B hovering out there for the U.S. reshoring effort, it is not surprising that anyone and everyone, involved in any way with the industry, is trying to devise a way to get part of the pie. It should also not surprise anyone that academia, who gets much of their...
Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma-based equipment and solutions for semiconductor manufacturers, is pleased to announce NIBC Bank as a new strategic financial partner. This partnership will enable Trymax to accelerate new technology developments and scale up its manufacturing capacity. The Dutch merchant bank is providing...
Just in case you didn’t have a chance yet to read part 1 of the ISS 2019 blog, covering day 1, it’s posted here. Technology and Manufacturing Trends Day 2 started with a keynote about the magic nanodevices can create, delivered byJo de Boeck, imec’s EVP and chief strategy officer. He emphasized that...
As it’s difficult to be in two places at one time, I was happy to see that the organizers of the co-located European MEMS and Sensors Summit/Imaging and Sensors Summits made sure two featured tracks —the MEMS and Sensors Technology Showcase and The Imaging Sensors Start-up Pitches — did not...
It’s been a whirlwind of conferences these past few weeks, and as a result, I have attended FOUR panel discussions on 2.5D and 3D related topics. (I already wrote about the 3D Test Workshop Panel – 3D Buzz Hype or Reality. It’s stirred quite a discussion.) The day before I...
All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM Institute, has begun pilot-line production of 3D semiconductor devices using a single-wafer, multi-chamber AltaCVD 300 system from Altatech Semiconductor S.A. At Fraunhofer IZM-ASSID’s 970-square-meter cleanroom facility in Dresden, Altatech’s
Day One: I'm not sure if it’s because it was the Monday after a U.S. holiday weekend, or just a Monday, but things seemed a bit slow out of the gate. I posted the first questions and waited. Paul Lindner of EV Group jumped right in on a positive...
In one of my all-time favorite movies, My Big Fat Greek Wedding, family patriarch, Kosta Portukalo is obsessed with his own culture, “Give me a word, any word, and I will show you how the root of that word is Greek.” I’m starting to feel that way about 3D technologies....
