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Lam Research announced quantifiable progress has been made toward its environmental, social and governance (ESG) goals with the release of its 2022 ESG report. Lam’s continued progress toward its ESG goals included exceeding its 2025 goals for water savings as well as surpassing its 2025 goal for employee volunteer hours, prompting...
COP 27 was held in the second and third week of November 2022. In the media, there was news of calls to accountability for promises made at COP 26, for which richer nations are still lagging. These included a $100 billion fund to assist smaller countries that are significantly impacted...
HALF MOON BAY, Calif. — April 5, 2022 — SEMI Industry Strategy Symposium (ISS) 2022 opened yesterday with the theme Semiconductors Leading a Transforming World to highlight semiconductor industry growth opportunities and challenges. The annual three-day conference of C-level and senior industry executives gives a comprehensive outlook of global electronics...
Addressing sustainability issues is a hot topic in the semiconductor industry, especially since Bloomberg highlighted that the industry’s carbon footprint is growing at a rapid clip while the auto industry’s carbon footprint has declined over the same period. However, the article only calls out GM as the automaker of reference....
If you love, like me, to work on the bleeding edge of technology, you will find that your personal success depends very much on the team around you, your company, even the entire supply chain. The organizers of this workshop – AMD’s Michael Alonso, Advantest’s Dave Armstrong, and MEPTEC’s Ira...
Rolla, Missouri – January 27th, 2020 – Brewer Science, Inc., is proud to introduce our first permanent bonding material during the European 3D & Systems Summit. This new material is included within the Brewer Science product family of PermaSOL™ materials designed to address device- and wafer-level packaging requirements. The new...
Ever since SEMICON West 2014, I’ve been seeing a lot of coverage of the 2.5D and 3D adoption question on Semiconductor Engineering, an industry content platform that covers the spectrum of semiconductor topics, and occasionally covers 2.5D and 3D, providing the perspective of chip architects, engineers, end users, industry organizations...
Good news! At last week’s GSA 3D IC Packaging Working Group Meeting, July 23, 2014, Jan Vardaman uttered the words I’ve been waiting to hear her say for quite some time. “Memory stacks with TSVs are here!” Vardaman cited three companies actively involved in new memory architectures, all of which...
Tuesday’s (July 15) Nightly Business Report surprised me with an – in my view – very important announcement: Apple and IBM are going to cooperate to offer enterprise solutions. See more about this significant step here and in many other headline news coming out this week. The former rivals are...
Fully Automated Manufacturing Technology Drives Growth for WLP Startup Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth wafer-level packaged (WLP) component. The company attributes this milestone to strong demand from portable electronics manufacturers for wafer-level chip scale packages (WLCSP)...
