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Recently, I worked on a grant proposal for the International Microelectronics and Packaging Society (IMAPS) Academy, as part of the Department of Commerce’s National Semiconductor Technology Center’s (NIST) workforce development initiative. Through this project, I experienced the semiconductor industry on a personal, first-hand level, working closely with IMAPS staff and...
The university setting offers a valuable environment for future engineers to explore and learn about technologies that will become part of their daily lives when transitioning from school to a career. At the same time, universities working on microelectronics and advanced R&D are increasingly looking for more advanced manufacturing equipment...
Brewer Science is one of only 27 Distinguished Award recipients across Intel’s global supply chain. Rolla, MO, March 28, 2024 – Brewer Science is proud to announce that it has earned Intel’s EPIC Distinguished Supplier Award. Through its dedication to Excellence, Partnership, Inclusion, and Continuous (EPIC) quality improvement, Brewer Science...
Siemens’ Tessent Multi-die software helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures. Global leader in design-for-test (DFT) technology paves the way for mainstream adoption of 3D ICs Innovative solution dramatically streamlines DFT cycles for highly complex multi-die...
Agreement covers design, manufacture and distribution of semiconductor equipment YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced a strategic alliance with SPEC (Semiconductor Process Equipment Corporation) of Valencia, California. Under the terms of the agreement, YES...
For the past few years, the ECTC committee has provided 3D InCites with a table outside the session rooms, rather than the technology corner, as part of our media trade. We consider it to be prime real estate, as pretty much everyone passes by the table at one time or...
Granted, while there may not have been a single “aha!” moment at the 2016 European MEMS Summit, held September 15-16 in Stuttgart Germany, the speakers did provide interesting food for thought as they talked about their companies’ activities and offerings in MEMS and sensor technology. 2016 European MEMS Summit from 3D...
I first visited Nimes, France when I was sixteen, on one of those whirlwind, ten-day, school-organized trips with my French 2 class. What I remembered most about it was the Roman architecture. We spent less than 24 hours there on the way to Avignon. At the time, I would never...
Despite the chilly San Francisco morning temperatures, a sizable crowd of 2.5D and 3D enthusiasts gathered at the Impress Lounge to witness the inaugural 3D InCites Awards Breakfast, held July 11, 2013 during SEMICON West. For me, it was especially significant as it marked four years since I first launched...
SUSS, being an equipment maker addressing various manufacturing challenges faced by 3D IC enablement, definitely has a lot riding on ensuring that all pieces of the 3D IC puzzle are in place. This was evident from the range of presenters they had lined up during this year’s Technology Forum, held...
