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Shaping Tomorrow’s Semiconductor Technology Since it began in 1955, the IEEE International Electron Devices Meeting (IEDM) has been where the world’s best and brightest electronics technologists go to learn about the latest breakthroughs in semiconductor and related technologies. That tradition continues this year, when the 70th annual IEEE IEDM conference...
Jean-Marie Brunet, Vice President and General Manager of the Siemens Hardware-Assisted Verification business unit finds himself and his group in a unique situation when it comes to the topic of chiplets. The group designs a chiplet for their own products and sells those products to verification engineers who are verifying...
3DIC Integration using 3D stacked technologies in its true definition has a long history.1 Richard P. Feynman expressed this vision in 1985: “Another direction of improvement of computing power is to make physical machines three-dimensional.”2 Successively, several research and development (R&D) initiatives started world-wide. In the late 1980s, in a...
Francoise will be presenting A Sustainable Future Requires Heterogeneous Integration at MicroTech 2021, the Annual IMAPS-UK Conference. Session 5 at 3:15pm Abstract: In September 2015, 193 member states of the UN adopted 17 new sustainable development goals (SDGs) to make our world more prosperous, inclusive, sustainable, and resilient. As a...
About 50 years ago, I started my career as a system-level designer, focused on an interface card for the Siemens T 1000. It was the first electronic teletype, destined to ship in extremely high volumes all over the world. When Siemens ramped up production, they invited me to the factory...
The semiconductor industry has entered a new era and the role of design including the package has become increasingly important. No longer can the industry count on monolithic integration to achieve the economic gains of the previous era. New packaging solutions are being adopted to achieve the economic advantages that...
Wow, times have changed. Who would have thought the foundries would ever willingly turn to the packaging industry for the solutions to future scaling? But I heard it myself yesterday at the ECTC luncheon keynote address, straight from the lips of Global Foundries’ CTO Greg Bartlett, who said that “silicon is not a...
Really, it all boils down to simple economics. I’m referring to WHY the road to 3D is taking as long as it is to reach commercialization. We’ve convinced the engineers of the technology benefits. Now it’s time to convince those who hold the purse strings: the management. I had an...
One of the main themes of last week’s MEMS Executive Congress was to “think outside the chip” (Roger Grace, of Roger Grace Associates) and rather, think of MEMS in terms of the system. However, to do that, there needs to be interaction between everyone involved in developing said system, including...
French research insitute, CEA-Leti and Docea Power, developers of software for power and thermal analysis at the architectural level, have entered into a common lab agreement to combine their expertise in 3D silicon integration and thermal and low-power design.
