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The university setting offers a valuable environment for future engineers to explore and learn about technologies that will become part of their daily lives when transitioning from school to a career. At the same time, universities working on microelectronics and advanced R&D are increasingly looking for more advanced manufacturing equipment...
Brewer Science is one of only 27 Distinguished Award recipients across Intel’s global supply chain. Rolla, MO, March 28, 2024 – Brewer Science is proud to announce that it has earned Intel’s EPIC Distinguished Supplier Award. Through its dedication to Excellence, Partnership, Inclusion, and Continuous (EPIC) quality improvement, Brewer Science...
Lam Research announced quantifiable progress has been made toward its environmental, social and governance (ESG) goals with the release of its 2022 ESG report. Lam’s continued progress toward its ESG goals included exceeding its 2025 goals for water savings as well as surpassing its 2025 goal for employee volunteer hours, prompting...
Agreement covers design, manufacture and distribution of semiconductor equipment YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced a strategic alliance with SPEC (Semiconductor Process Equipment Corporation) of Valencia, California. Under the terms of the agreement, YES...
Rolla, Missouri – January 27th, 2020 – Brewer Science, Inc., is proud to introduce our first permanent bonding material during the European 3D & Systems Summit. This new material is included within the Brewer Science product family of PermaSOL™ materials designed to address device- and wafer-level packaging requirements. The new...
Granted, while there may not have been a single “aha!” moment at the 2016 European MEMS Summit, held September 15-16 in Stuttgart Germany, the speakers did provide interesting food for thought as they talked about their companies’ activities and offerings in MEMS and sensor technology. 2016 European MEMS Summit from 3D...
Good news! At last week’s GSA 3D IC Packaging Working Group Meeting, July 23, 2014, Jan Vardaman uttered the words I’ve been waiting to hear her say for quite some time. “Memory stacks with TSVs are here!” Vardaman cited three companies actively involved in new memory architectures, all of which...
Tuesday’s (July 15) Nightly Business Report surprised me with an – in my view – very important announcement: Apple and IBM are going to cooperate to offer enterprise solutions. See more about this significant step here and in many other headline news coming out this week. The former rivals are...
Fully Automated Manufacturing Technology Drives Growth for WLP Startup Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth wafer-level packaged (WLP) component. The company attributes this milestone to strong demand from portable electronics manufacturers for wafer-level chip scale packages (WLCSP)...
I first visited Nimes, France when I was sixteen, on one of those whirlwind, ten-day, school-organized trips with my French 2 class. What I remembered most about it was the Roman architecture. We spent less than 24 hours there on the way to Avignon. At the time, I would never...
