Matches for your search: "fan-out wafer level packaging "
Thermal problems in semiconductor electronic systems often go unnoticed and cause failures. Although thermal problems can be understood and avoided by proper design, it takes time and money to build a new system with improved thermal performance. The good news is that there are many thermal analysis tools available that...
Apps natively integrated with the Xcelium Logic Simulator enable users to target domain-specific needs for highest verification performance SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced Xcelium Apps, a portfolio of domain-specific technologies implemented natively on the Cadence® Xcelium™ Logic Simulator kernel that enable automotive, mobile and...
Leave it to Bill Chen, ASE, to set an optimistic tone for the 2021 Global Business Council Spring Meeting. It was exactly what the packaging community needed to hear. The last time many of us met in person at an industry event was at the 2020 IMAPS Device Packaging Conference...
Before I could start writing my blog post about the keynote talks delivered at the 2021 Virtual IMAPS Device Packaging Conference, I first had to find out what an XPU was. I’m often stymied by this industry’s penchant for acronyms and my journalistic need to write them out in the...
The IEEE International Solid-State Circuits Conference, – ISSCC 2021 – took place in late February. As we have suspected for some time, these formerly front-end conferences are more and more focusing on packaging and the performance advances you get from new packaging architectures. Let’s first take a look at what...
Substrate capacity remains tight for both flip chip ball grid array (FC-BGA) substrates and laminate-based chip scale packages (CSPs). Substrate suppliers are adding capacity to meet the demand for FC-BGA substrates for server, graphics processor, and networking applications, but demand continues to outstrip supply. Regardless of the package type—whether silicon...
For us at Siemens Digital Industries Software, COVID -19 brought the closure of all our offices and the beginning of learning how to work, collaborate, and do business virtually. The interaction with customers and prospects typically happens on a very personal level, with sales and technical account executives traveling to...
“Don’t surround yourself with yourself …” Yes, from I’ve Seen All Good People. “At Japan’s Most Elite University, Just 1 in 5 Students Is a Woman.” The New York Times, 08 December 2019 “The semiconductor industry isn’t known as a standout example of diversity and inclusion. But that’s changing.” Jane...
Samsung reports that they have seen increasing interest in multi-die integration (what they call MDI) for markets such as artificial intelligence (AI) and high-performance computing (HPC). They also report a need for new electronic design automation (EDA) solutions because the traditional design doesn’t fully address the latest power and signal...
Silver Sponsors: Submit your 2021 3D InCites Awards nomination to recognize excellence in heterogeneous integration. 3D InCites Awards nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer...
