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Thermal problems in semiconductor electronic systems often go unnoticed and cause failures. Although thermal problems can be understood and avoided by proper design, it takes time and money to build a new system with improved thermal performance. The good news is that there are many thermal analysis tools available that...
Substrate capacity remains tight for both flip chip ball grid array (FC-BGA) substrates and laminate-based chip scale packages (CSPs). Substrate suppliers are adding capacity to meet the demand for FC-BGA substrates for server, graphics processor, and networking applications, but demand continues to outstrip supply. Regardless of the package type—whether silicon...
For us at Siemens Digital Industries Software, COVID -19 brought the closure of all our offices and the beginning of learning how to work, collaborate, and do business virtually. The interaction with customers and prospects typically happens on a very personal level, with sales and technical account executives traveling to...
Onto Innovation’s latest inspection advances have resulted in multiple orders from a top 3 OSAT and a top 3 image sensor manufacturer Wilmington, Mass., January 12, 2021 – Onto Innovation Inc. (NYSE: ONTO) today announced the availability of its new Dragonfly® G3 inspection platform designed to meet the most advanced...
The market for high bandwidth memory (HBM) is projected to grow 49% in wafers, including DRAM and logic layers, from 2020 to 2024. Growth is driven by increased adoption in high-performance computing such as AI, networking, graphics, and future server processors. Solutions to package HBM plus logic include silicon interposers...
A lot can happen in a year. And 2020 is certainly no exception. COVID-19 had an enormous impact on our ability to distribute print issues of the Yearbook at industry events. However, we are excited to report that we will move forward with a digital-only version of the 2021 Yearbook,...
iMAPS: Enabling a Connected World: Always On! 3D InCites will be participating in the iMAPS 2020 virtual symposium, October 5-8, 2020. Come check out our virtual profile to learn more about our community membership and 2021 editorial and marketing opportunities. We have compiled a list of papers, presentations and exhibitor...
“Don’t surround yourself with yourself …” Yes, from I’ve Seen All Good People. “At Japan’s Most Elite University, Just 1 in 5 Students Is a Woman.” The New York Times, 08 December 2019 “The semiconductor industry isn’t known as a standout example of diversity and inclusion. But that’s changing.” Jane...
Samsung reports that they have seen increasing interest in multi-die integration (what they call MDI) for markets such as artificial intelligence (AI) and high-performance computing (HPC). They also report a need for new electronic design automation (EDA) solutions because the traditional design doesn’t fully address the latest power and signal...
Silver Sponsors: Submit your 2021 3D InCites Awards nomination to recognize excellence in heterogeneous integration. 3D InCites Awards nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer...
