Matches for your search: "fan-out wafer level packaging "
Thermal problems in semiconductor electronic systems often go unnoticed and cause failures. Although thermal problems can be understood and avoided by proper design, it takes time and money to build a new system with improved thermal performance. The good news is that there are many thermal analysis tools available that...
Apps natively integrated with the Xcelium Logic Simulator enable users to target domain-specific needs for highest verification performance SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced Xcelium Apps, a portfolio of domain-specific technologies implemented natively on the Cadence® Xcelium™ Logic Simulator kernel that enable automotive, mobile and...
Leave it to Bill Chen, ASE, to set an optimistic tone for the 2021 Global Business Council Spring Meeting. It was exactly what the packaging community needed to hear. The last time many of us met in person at an industry event was at the 2020 IMAPS Device Packaging Conference...
Before I could start writing my blog post about the keynote talks delivered at the 2021 Virtual IMAPS Device Packaging Conference, I first had to find out what an XPU was. I’m often stymied by this industry’s penchant for acronyms and my journalistic need to write them out in the...
The IEEE International Solid-State Circuits Conference, – ISSCC 2021 – took place in late February. As we have suspected for some time, these formerly front-end conferences are more and more focusing on packaging and the performance advances you get from new packaging architectures. Let’s first take a look at what...
“Don’t surround yourself with yourself …” Yes, from I’ve Seen All Good People. “At Japan’s Most Elite University, Just 1 in 5 Students Is a Woman.” The New York Times, 08 December 2019 “The semiconductor industry isn’t known as a standout example of diversity and inclusion. But that’s changing.” Jane...
Samsung reports that they have seen increasing interest in multi-die integration (what they call MDI) for markets such as artificial intelligence (AI) and high-performance computing (HPC). They also report a need for new electronic design automation (EDA) solutions because the traditional design doesn’t fully address the latest power and signal...
Last week I attended SEMICO’s Research Summit, in Scottsdale, AZ, and was fortunate to hear some high-level industry executives discuss the emerging landscape of the semiconductor industry, and 3D integration’s role in it. What was most interesting was the resounding call across the board for collaboration across the supply chain,...
NEXX Systems' 10th Anniversary celebration dawned sunny, warm and dry, a rare occurrence these days in the Northeast. In fact, the company was taking quite a risk to plan an outdoor celebration, regardless of the tent. But that pretty much describes the company’s overall approach to business, and why they’ve...
Take note everyone in charge of event planning: Léti really upped the ante last night at their Annual Research Reviews Gala event, held outside of Grenoble at the lovely Hotel Chavant. While attendees sipped wine and socialized on the outdoor terrace under a green canopy of Chestnut trees adorned with...
