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A lot can happen in a year. And 2020 is certainly no exception. COVID-19 had an enormous impact on our ability to distribute print issues of the Yearbook at industry events. However, we are excited to report that we will move forward with a digital-only version of the 2021 Yearbook,...
iMAPS: Enabling a Connected World: Always On! 3D InCites will be participating in the iMAPS 2020 virtual symposium, October 5-8, 2020. Come check out our virtual profile to learn more about our community membership and 2021 editorial and marketing opportunities. We have compiled a list of papers, presentations and exhibitor...
In the early days of ASIC technology, only logic library elements and basic I/Os with up to 10s of transistors were available for customizing gate arrays and/or logic functions in standard cell chips. And then, “megacells” (a.k.a. Functional Blocks, Semiconductor IP Blocks), comprised of 100s, even 1000s, and more transistors...
Despite the economic downturn caused by the fight against the Covid-19 virus pandemic, there are some potential growth areas this year. Growth in advanced packaging continues for datacenter servers, AI accelerators, and the 5G infrastructure. The shelter-in-place requirements have driven out-of-season demand for game consoles, commercial and educational laptops and...
Brian Schmalz, NAMICS, Talks About the Future of Electronics Materials Since we launched the program in January, the 3D InCites Community has already grown to 29 members. I visited with a few of them in person at IMAPS DPC to learn more about them, get updates on their activities in...
Large area fan-out (FO) remains a hot topic in the industry. There is some confusion over the term “panel” because IC package substrates are processed in panels. The main driver for large area FO panel development is cost reduction because more parts can be processed in a batch. TechSearch International’s...
It’s official. The world is becoming more data-driven by the second and everything – I mean EVERYTHING – hinges on the success of 5G. 5G will make smart factories more efficient; bring medical care to remote places; make the autonomous vehicle infrastructure possible so you stop rear-ending the person in...
We are preparing content for our 2nd annual print edition! 3D InCites is Looking for: Executive viewpoints on today’s megatrends and what’s needed to achieve them. Contributed Technology Features on topics like: Chiplet integration techniques Process improvements for panel and wafer-level fan-out Inspection technologies for heterogeneous integration (HI) Advancements in...
Driven by advanced packaging substrate needs, the industry has reached an inflection point in IC substrate manufacturing. Increasing I/O counts are driving substrate layer counts to more than 20. Larger die sizes and multiple die mounted on the substrate are driving the need for larger body sizes, up to 100...
Submit your 2020 3D InCites Awards nomination to recognize excellence in heterogeneous integration. Nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer-level packaging,...
