ECTC 2014: Bridging the Gap to 2.5D and 3D
Each year since I first attended the IEEE Electronic Component Technology Conference (ECTC) in 2009, the keynotes, panels and papers focused on 2.5D and 3D integration technologies has increased; every year, that is, until this year. At ECTC 2014, there were not any plenary or panels focused specifically on 2.5D...