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Each year since I first attended the IEEE Electronic Component Technology Conference (ECTC) in 2009, the keynotes, panels and papers focused on 2.5D and 3D integration technologies has increased; every year, that is, until this year. At ECTC 2014, there were not any plenary or panels focused specifically on 2.5D...
While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB) to be an unsolvable challenge that adds unnecessary cost. The solution? Find a way to do away with it altogether. During the 3D IC Forum at SEMICON Singapore, both A*STAR...
This week, at the invitation of SEMI Southeast Asia, I made the monumental trek from Phoenix, AZ to Singapore to attend SEMICON Singapore. While I know many of my industry colleagues make these journeys in the regular course of business, this was a new experience for me and my first...
For quite some time, the lack of cost-effective test solutions for 2.5D interposers and 3D stacked ICs (3D SICs) has been at the top of many industry experts’ laundry list of ‘what’s-holding-up-commercialization for 3D’. First, there are technology issues: fine-pitch probing, pin count, contact force and the phenomenon of weak...
Solid State Equipment LLC (SSEC), provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D-ICs), MEMS, and compound semiconductor markets, announces two major wins for its WaferStorm platform at a leading foundry in Asia and a major US integrated device manufacturer (IDM). In both cases, the systems...
Don’t let the skeptics fool you, contrary to popular belief, the 3D test community has been hard at work on solutions for overcoming 3D test challenges. I am attending The Fourth IEEE International Workshop on testing 3D Stacked ICs (3D Test Workshop for short) at the Disneyland Hotel in Anaheim,...
Naysayers be damned! Full commercialization for 3D ICs in smartphones may be a few years out, but that doesn’t dampen the spirits of the truly devoted, who latch on to every forward step as a monumental accomplishment. This week, progress appears to be taking off for 2.5D products, and the...
Has it really been a month since the European 3D TSV Summit? This inaugural event certainly caused a buzz in the blogosphere! In addition to all my coverage after having attended the event, Phil Garrou has been slogging his way thorough the proceedings to provide an in-depth review on Insights...
After attending last week’s 9th Annual Architectures for Semiconductor Integration and Packaging Conference in Redwood City, CA, it’s pretty clear that there’s probably the same chance of 3DIC NOT happening, as there is a chance the world will end on Dec 21. (And oh by the way, Tom Pawlowski, chief...
The latest digital issues of Chip Scale Review and iMicronews’ 3D Packaging magazines hit the virtual “stands” last week, and perhaps in honor if the 3D ASIP Conference that gets underway later this week, there are some hot new 3D technologies being featured. But first, to bring everyone up to...
