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As promised in part 1 of my ECTC 2015 blog about this impressive conference, see below summaries of presentations I found very useful to contribute to the advancement of single- and multi-die packaging. To make it easier for the reader to dig deeper and review the entire paper, I included in...
With new packages continuously being introduced, TechSearch International’s latest Advanced Packaging Update focuses on making some sense out of the alphabet soup of package options for split die. Application targets range from high-performance solutions for devices such as FPGAs to application processors found in mobile devices. SLIM, SWIFT, EMIB, NTI,...
Yole Développement invites you to discover the main technology trends and business opportunities for 3D integration in 2015. As a research market & strategy consulting company, Yole Développement (Yole) works with the leaders of the advanced packaging industry every day to understand technical challenges and market issues. In this article,...
One look at the agenda for the 11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP), and it becomes clear that this year the conference organizers have left no stone unturned. Kicking it off with Pre-conference Symposia that emphasize 3D design tools and flow and manufacturing processes,...
In my previous post I talked a bit about the ongoing debate that went on during last week’s Global Interposer Technology Workshop (GIT 2014) which took place at Georgia Tech’s Global Learning Center. Do we wait for the “trickle down” effect to take place and bring the cost of interposer and...
Manufacturing of 3D IC heterogeneous integrated modules for the electronics of a leadless pacemaker in a very small volume has been realized. Manufacturing of 3D IC modules using the described process is ready for medium volume production. Testimonial All the electronics of a leadless pacemaker has been integrated into a...
Each year since I first attended the IEEE Electronic Component Technology Conference (ECTC) in 2009, the keynotes, panels and papers focused on 2.5D and 3D integration technologies has increased; every year, that is, until this year. At ECTC 2014, there were not any plenary or panels focused specifically on 2.5D...
This week, at the invitation of SEMI Southeast Asia, I made the monumental trek from Phoenix, AZ to Singapore to attend SEMICON Singapore. While I know many of my industry colleagues make these journeys in the regular course of business, this was a new experience for me and my first...
For quite some time, the lack of cost-effective test solutions for 2.5D interposers and 3D stacked ICs (3D SICs) has been at the top of many industry experts’ laundry list of ‘what’s-holding-up-commercialization for 3D’. First, there are technology issues: fine-pitch probing, pin count, contact force and the phenomenon of weak...
Solid State Equipment LLC (SSEC), provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D-ICs), MEMS, and compound semiconductor markets, announces two major wins for its WaferStorm platform at a leading foundry in Asia and a major US integrated device manufacturer (IDM). In both cases, the systems...
