Matches for your search: "fan-out wafer level packaging "
SEMICON Taiwan is arguably the most influential semiconductor event in Taiwan, reaching records high in terms of scale in its 27 years of history, attracting 700 exhibitors, using a total of 2,450 booths, and organizing more than 20 international forums. This year it will spotlight eight key industry themes: advanced...
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference Center, with an anticipated record number in attendance. The microelectronics assembly & advanced packaging event will bring together industry engineers, researchers and top experts participating in a multi-faceted technical program...
One of the most popular booths at the recent IMAPS DPC was that of wafer-level fan-out technology provider, Deca. Their black tee shirts state “SHIFT HAPPENS” on the front and on the back say, “We clean it up” (referring to their adaptive patterning of course). Also of great interest was...
Heterogeneous integration (HI) is fast becoming a key driver of semiconductor development due to its ability to scale the number of individual chips onto a miniaturized system-in-package that enhances functionality, achieves higher efficiency, and even reduces power consumption. At the recently concluded SEMICON CHINA 2021 Advanced Packaging Forum, Dr KK...
SEMICON China attracts the world’s leading technology companies who design, develop, manufacture, and supply the technologies to manufacture the microelectronics that drive today’s most sophisticated consumer and commercial electronic products. Many of our 3D InCites community members are exhibiting and/or presenting during the show. Here is a preview of what...
Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer solvent, wet process tool and its AP300™ lithography system to support the growth of its outsourced assembly and test (OSAT) business. One of the first independent wafer bumping service providers...
SEMICON Europa was an island in the vast sea of Electronica. It occupied one hall out of 18. But without that hall full of equipment, process, and material suppliers, the other 17 wouldn’t have any reason to exist. Think about that for a bit. There’s a reason “Semiconductors drive smart”...
2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM), FOWLP volumes significantly increased in magnitude. Will this strong momentum...
KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP™ and ICOS® T830. Designed for characterization and monitoring of the diverse processes used in wafer-level packaging, CIRCL-AP enables all-surface wafer defect inspection, review and metrology at high throughput. The ICOS T830 provides fully automated optical...
Follow-on Order Demonstrates the Strength of EVG’s High-volume Manufacturing Solutions for Wafer-level Camera Applications
