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EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and IBM (NYSE: IBM) today announced that the companies agreed to sign a license agreement on laser debonding technology. EVG plans to integrate IBM’s patented Hybrid Laser Release process into EVG’s...
Wilmington, Mass. (May 23, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received an order for its JetStep S Lithography System for fan-out panel-based advanced packaging processes. The system, which will ship in June 2017 to an outsourced assembly and test (OSAT) facility based in Asia, will be...
At the end of April, I attended the Internet of Things (IoT) Developers Conference at the Santa Clara Convention Center. Because our semiconductor industry is expecting that IoT applications will significantly contribute to revenue growth, I wanted to get the latest about: If, how, when, why and for which applications...
A variety of alternatives is challenging silicon’s role in advanced packaging interposers for high-performance package applications. The first applications using silicon interposers with through silicon vias (TSVs) were field programmable gate arrays (FPGAs), followed by graphic processor units (GPUs). Though unit volumes have been small, the vast knowledge gained from...
Wilmington, Mass. (February 16, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading memory manufacturer in Asia has placed orders totaling over $8 million USD for process control equipment to support the ramp of their latest high-performance stacked memory devices. The equipment spans front- and back-end applications. It includes MetaPULSE® metrology...
After a fairly long vacation it’s very hard to get back to work. That’s why I was really glad that this year’s OIP Symposium helped me – right after touring Europe for 3 weeks – to finding my groove again. Allow me to share some of my observations at and thoughts...
MEPTEC Luncheons returned big to The Bay Area on Wednesday, May 25, 2016, with a new venue (SEMI HQ), a new joining of forces (IMAPS-MEPTEC-SEMI), a great turn-out (fully committed, capacity-wise, as they say in the restaurant biz), and an inspiring talk by Bill Chen, ASE Fellow and Senior Technical...
With the industry-wide shift in focus from furthering Moore’s Law to the realization that 3D integration and advanced packaging technologies are the shining stars of the next generation of electronics, the 66th Annual IEEE Electronic Components Technology Conference, which takes place May 31-June 3, 2016, at the Cosmopolitan of Las...
TEMPE, Ariz. – March 23, 2016 – Amkor Technology Inc. (Nasdaq: AMKR), a leading semiconductor packaging and test service provider, today announced it has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications. This achievement establishes Amkor’s leadership in delivering low-cost, high-performance advanced SiP solutions....
Since the dawn of the industry, semiconductor companies have developed disruptive technologies and solutions that have met the most ambitious targets. In a dynamic and global marketplace, they anticipate market needs and design and make the right product at the right time. What’s the key to this success? The supply...
