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The business model in today’s competitive world of commerce has shifted over recent years to “services.” Companies like Microsoft, Amazon, and Google are prime success stories that have advanced the industry with business-enabling services. These economic productivity improvement services allow their customers to focus on product architecture, design, and quick...
After attending last week’s 9th Annual Architectures for Semiconductor Integration and Packaging Conference in Redwood City, CA, it’s pretty clear that there’s probably the same chance of 3DIC NOT happening, as there is a chance the world will end on Dec 21. (And oh by the way, Tom Pawlowski, chief...
The latest digital issues of Chip Scale Review and iMicronews’ 3D Packaging magazines hit the virtual “stands” last week, and perhaps in honor if the 3D ASIP Conference that gets underway later this week, there are some hot new 3D technologies being featured. But first, to bring everyone up to...
Glass interposers got a thumbs up from i-MicroNews in a “Closer Look” post reviewing Corning’s Peter Bocko’s presentation at IMAPS 2012. Based on work done as part of Ga Tech’s consortium, Bocko demonstrated that “glass interposers show less warp during chip assembly, faster signal propagation and significantly reduced signal loss. In...
Georgia Tech’s Packaging Research Center, in its pioneering chip-last embedded interconnection technology, demonstrates World's Thinnest 3D Organic Package at 130um thickness at 30um interconnection pitch using ultra-short copper-copper interconnections and bonding below 200oC for highest electrical performance. The "Ultra-SLIM Packages have built-in vertical connections to the top surface
The Burn‐in & Test Socket Workshop (BiTS Workshop) announced today that it is changing its name to The Burn‐in & Test Strategies Workshop (BiTS Workshop). The rebrand, which features an updated logo, is reflected in all of BiTS collateral material and the website for the 2012 BiTS Workshop that takes...
Two weeks ago, wearing my Chip Scale Review Sr. technical editor hat, I attended (along with 11 other journalists) an exclusive press conference launching a new electronic interconnect company, Deca Technologies, which claims to have developed disruptive manufacturing processes based on its sister company, SunPower’s, solar cell wafer processes, rather...
SEMICON Singapore gets underway next week (May 19-21), and the 3D track speaker line-up features presentations by several 3D InCites partners. If you plan on attending, be sure to put these sure-to-be interesting talks on your personal agenda.
I wish I could be everywhere at once, because there are so many events involving 3D coming up well worth attending. Unfortunately short of cloning myself, which I don’t think the world is ready for, there’s no way for me to cover everything. So instead, I’ve come up with an...
While I’m clearly a huge believer of leveraging the Internet for interactive communication (heck, 3D InCItes was founded on that) I have to admit that there’s still no substitute for human interaction. Attending yesterday’s MEPTEC Southwest Luncheon, featuring Mark Stromberg from Gartner Dataquest, offered more than just an update on...
