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On Thursday, September 17, I was invited to attend TSMC’s Open Innovation Platform (OIP) conference, that showed TSMC’s rapid progress and the power of TSMC’s Grand Alliance. As a former Alliance Manager, I really enjoyed seeing how TSMC’s far-reaching vision and strategic alliances, combined with excellent execution and customer service,...
Garching, September 24, 2015 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, has received an order for multiple SUSS MicroTec Photonic Systems lithography tools in Q3 2015 from a leading semiconductor manufacturer. The strategically important order includes multiple DSC300 Gen2...
I recently started watching the HBO sitcom, Silicon Valley. If you haven’t seen it, it’s a great parody of what life in the Valley taken over by socially awkward technology geniuses looks like. It’s pretty funny, and a little bit scary. In one episode, the Pied Piper team is presenting...
As promised in part 1 of my ECTC 2015 blog about this impressive conference, see below summaries of presentations I found very useful to contribute to the advancement of single- and multi-die packaging. To make it easier for the reader to dig deeper and review the entire paper, I included in...
With new packages continuously being introduced, TechSearch International’s latest Advanced Packaging Update focuses on making some sense out of the alphabet soup of package options for split die. Application targets range from high-performance solutions for devices such as FPGAs to application processors found in mobile devices. SLIM, SWIFT, EMIB, NTI,...
Yole Développement invites you to discover the main technology trends and business opportunities for 3D integration in 2015. As a research market & strategy consulting company, Yole Développement (Yole) works with the leaders of the advanced packaging industry every day to understand technical challenges and market issues. In this article,...
One look at the agenda for the 11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP), and it becomes clear that this year the conference organizers have left no stone unturned. Kicking it off with Pre-conference Symposia that emphasize 3D design tools and flow and manufacturing processes,...
In my previous post I talked a bit about the ongoing debate that went on during last week’s Global Interposer Technology Workshop (GIT 2014) which took place at Georgia Tech’s Global Learning Center. Do we wait for the “trickle down” effect to take place and bring the cost of interposer and...
Manufacturing of 3D IC heterogeneous integrated modules for the electronics of a leadless pacemaker in a very small volume has been realized. Manufacturing of 3D IC modules using the described process is ready for medium volume production. Testimonial All the electronics of a leadless pacemaker has been integrated into a...
Each year since I first attended the IEEE Electronic Component Technology Conference (ECTC) in 2009, the keynotes, panels and papers focused on 2.5D and 3D integration technologies has increased; every year, that is, until this year. At ECTC 2014, there were not any plenary or panels focused specifically on 2.5D...
