Matches for your search: "fan-out wafer level packaging "
A recent Wall Street Journal article, The Microchip Era Is Giving Way to the Megachip Age, explains how the chip industry is transitioning from monolithically integrated chips to stacking chiplets to make megachips. In the U.S., DARPA is embarking on the Next Generation Microelectronic Manufacturing initiative focused on three-dimensional heterogeneous...
Reno Sub-Systems (Reno), a developer of high performance radio frequency (RF) matching networks for leading-edge nanoscale semiconductor manufacturing, today introduced its new GenMatch™ Series that integrates the company’s proven solid-state Electronic Variable Capacitor (EVC™) RF match and Precis™ generator technologies into a single unit. The systems have a footprint similar...
San Jose, California – USA – The International Wafer-Level Packaging Conference and Expo announces Dan Oh, Ph.D., Engineering VP of the Test & System Package (TSP) unit at Samsung Electronics will deliver the opening keynote presentation of the virtual event. The presentation, “Trends, Challenges, Opportunities in Advanced Packaging for Smart...
SEMI held its annual Industry Strategy Symposium (ISS 2019) at the Ritz Carlton in Halfmoon Bay, CA January 6-9, 2019. Many high-level executives represented key areas of the electronic products supply chain. Former government officials emphasized that our country’s leaders recognize the strategic importance of semiconductors. The theme of ISS...
The Friday 3D Integration Workshop at DATE 2014 once again found me among friends, as an intimate group of about 30 gathered to spend a day sharing knowledge gained since last year’s workshop. My key take-away for the day was how to achieve reliability and robustness. Jürgen Wolf, director of...
Thank you, Ann Steffora Mutschler (Semiconductor Engineering) for getting to the bottom of the difference of EDA tools for 2.5D and 3D IC design and test, and providing such a clear explanation in your post, “Evolution vs. Revolution”. In this 2-part post, Mutschler explores the EDA vendor arguments that “tool...
Wouldn’t it be great to get a text notification that you are almost out of toilet paper at home rather than when it’s well… almost too late? Or how about an intra-nasal sensor that detects the level of acetone in your breath to tell you if you’re accumulating or burning...
When is an active die not an active die? When it’s an active interposer, of course! Ever since Nicolas Sillon, former head of CEA Leti’s 3D Integration program, first talked about the research institutes’ work with interposer technology for 3D integration, the term “active interposer” has sparked controversy and begged for definition....
There’s probably no more fitting venue for discussing future directions for processing and packaging technology in integrated circuit fabrication than the Computer History Museum in Mountain View, CA. After all, “The mission of the Computer History Museum is to preserve and present for posterity the artifacts and stories of the...
2.5D Interposer: A configuration where dies are mounted side by side on one side of a thin (~ 100 um) silicon, glass, or organic interposer using through silicon vias (TSVs), through glass vias (TGV) or through substrate vias (TSV), respectively through the interposer to connect the dies with the package...
