Matches for your search: "fan-out wafer level packaging "
Live from “Silicon Desert”: The news is all about huge spending by TSMC and Intel. Investment in advanced packaging (2.3/2.5/3D including chiplets) is increasing. As a 5nm design effort tops $500M and photo tools approach $150M, it was necessary to bust up systems-on-chip (SoCs) into re-partitioned systems – where functions...
In order to remain competitive in the Internet-of-Things (IoT) environment, medium-sized industrial and process measurement technology companies must increasingly integrate their sensor circuits on ASICs (Application Specific Integrated Circuits). The semiconductor industry is currently meeting this need with lower costs for development processes and lower thresholds in terms of production...
Eight years in the making, the IEEE Std 1838™-2019 Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits — or IEEE 1838, DfT for 3D IC, as it’s known in inner circles – was published on March 13, 2020. Simply put, this standard will allow stacked dies in 3D ICs to connect...
Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November 13, 2019, two well-known industry experts, Anand Joshi and Tom Dillinger, addressed today’s hot topics —neural networks and System-on-Chip (SoC) design challenges — with short, but very informative presentations. Can...
Semiconductor supply chain, ecosystem, value chain: whatever you call it, its become a hot topic of discussion, and one that is near and dear to my heart as a supporter of 3D IC commercialization. Well over a year (maybe even going on two) we’ve been hearing suggested changes like a...
Because I interact with people involved in 3D across the entire spectrum of its meaning, I tend to be privy to varied perspectives and opinions when it comes to the adoption of TSV as a method of interconnect for 3D integration. One thing is perfectly clear – support for TSV...
While it was Good Friday for most, it was 3D Friday for those of us who attended the 19th Annual Electronic Design Process Symposium (EDPS), held last week in Monterey CA. What an amazing location! For an ocean-starved desert dweller like me, it was hard to tear my eyes off...
I just finished putting together a presentation for the upcoming BiTS Workshop March 7-10, 2010 taking place in my backyard in Mesa, AZ.
The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference, held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.
The IWLPC tutorials are application oriented and structured to combine field experience with...
As I was unable to attend Design Automation Test in Europe (DATE 2009) myself, but felt the information being shared there would be useful to my readers, I asked fellow 3D enthusiast, Yann Guillou, new technology marketing, St Ericsson, if he would write a guest post for “Françoise in 3D”....
