Matches for your search: "fan-out wafer level packaging "
May member news showcases significant strides in advancing semiconductor technologies and fostering sustainability efforts. From strategic divestitures and innovative product launches to educational initiatives and workforce development programs, the semiconductor industry continues to evolve and thrive. Dive into the latest updates from our member companies and stay informed about the...
FLORIAN, Austria, June 21, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that, for the fourth successive year, it has earned all three awards resulting from VLSIresearch Inc.’s annual Customer Satisfaction Survey. For 2016, EVG was ranked...
This year’s IMAPS International Symposium purported to have “the most interposer and 3D content under one roof.” I’m not sure about that, but there was certainly enough 3D going on at IMAPS 2014 to spark my interest. Here are some highlights I came away with, based on presentations, interviews with...
I don’t usually write about MEMS. But every once in a while, when MEMS (stands for micro-electromechanical systems) touches anything to do with 3D integration, usually at the system-level, I might veer slightly out of my comfort zone to interview a MEMS supplier about their latest developments. I find it’s...
Flanders, New Jersey (August 11, 2014)—Rudolph Technologies, Inc. announced today that it has received a large order from one of Taiwan’s providers of independent semiconductor manufacturing services in assembly and test (OSAT) for 2D/3D inspection systems. The order includes: multiple NSX® systems for two-dimensional (2D) macro defect inspection, the Wafer...
ST. FLORIAN, Austria, February 11, 2014 — EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing (HVM)—the EVG150XT resist coating and developing system. Leveraging EVG’s XT Frame...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SET is known in the 3D IC world for its high accuracy die bonder for die-to-die and die-to-wafer stacking. The SET Representative in North America (SETNA) has also launched a companion tool, ONTOS7,...
For the past year or so at various conferences, symposiums and summits focused on 2.5D and 3DIC technologies; we’ve been hearing suggestions about business model scenarios. It’s boiled down to three distinct choices. First is a ‘single integration’ model where end-to-end manufacturing takes place in one location – most likely...
I’ve been on a mission to interview the directors of all three European microelectronics research centers that are participating in the European 3D TSV Summit before the event takes place. So far I’ve checked imec and Leti off the list. Last week, I finally was able to achieve the trifecta...
SEMATECH’s story is one that is truly built upon the essence of collaboration. SEMATECH is not a traditional research center. Rather, it is a technology research consortium that exists to serve the best interests of its worldwide members and partners. Originally established in Austin, TX as an experiment in combining...
