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Taiwan Semiconductor Research Institute Selects Veeco MOCVD System for Advanced R&D and Technology Collaboration for Power and RF Applications

Jun 08, 2022

Plainview, N.Y., June 8, 2022—Veeco Instruments Inc. (NASDAQ: VECO) today announced that the Taiwan Semiconductor Research Institute, National Applied Research Laboratories (TSRI, Narlabs) has selected Veeco’s Propel® R&D Metal Organic Chemical Vapor Deposition (MOCVD) System for advanced development and collaboration related to gallium nitride (GaN)-based power and RF devices.  The...

Ultratech Introduces Superfast 4G Low-cost In-line Inspection System for Patterned Wafers

Nov 24, 2014

Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today introduced the Superfast 4G high-volume, in-line, 3D topography inspection system. Ultratech’s new 4G system builds on the field-tested capability of the Superfast 3G, providing the industry’s highest-productivity and lowest-cost...

Proof that the Collaboration Model Works for 3D ICS

Feb 04, 2013

For the past year or so at various conferences, symposiums and summits focused on 2.5D and 3DIC technologies; we’ve been hearing suggestions about business model scenarios. It’s boiled down to three distinct choices. First is a ‘single integration’ model where end-to-end manufacturing takes place in one location – most likely...

Juergen Wolf, Fraunhofer IZM-ASSID

Fraunhofer IZM Update with M. Juergen Wolf

Dec 19, 2012

I’ve been on a mission to interview the directors of all three European microelectronics research centers that are participating in the European 3D TSV Summit before the event takes place. So far I’ve checked imec and Leti off the list. Last week, I finally was able to achieve the trifecta...

EV Group Unveils Its Next-Generation EVG150 Automated Resist Processing Platform for High-Volume Coating/Developing Applications

Jul 03, 2012

Redesigned, Fully Automated Modular System Integrates Unmatched Spray Coating Processes for MEMS, Compound Semiconductors and Advanced Packaging SEMICON TAIWAN, Taipei, September 4, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation EVG150 automated resist...

Ziptronix Announces Industry’s Lowest Distortion Capability For Backside Illuminated Image Sensor Applications

Feb 11, 2011

Ziptronix Inc., the leading developer of direct bonding technology for advanced semiconductor applications, announced today that recent collaborations with major image-sensor manufacturers have shown that the Ziptronix ZiBondTM direct bonding process contributes minimum distortion in backside illuminated (BSI) image sensors. “In addition to confirming that the Ziptronix direct bonding technology

3D Integration Research, SEMATECH Style

Nov 21, 2010

SEMATECH’s story is one that is truly built upon the essence of collaboration.  SEMATECH is not a traditional research center.  Rather, it is a technology research consortium that exists to serve the best interests of its worldwide members and partners. Originally established in Austin, TX as an experiment in combining...

Suppliers offer solutions to TSV formation challenges

Nov 13, 2009

As part of the 3D tracks at both this year’s International Wafer Level Packaging Conference, held October 27-30 in Santa Clara, CA; and the 2009 IMAPS International Symposium, held Nov 3-5 in San Jose, CA, several suppliers offered up solutions addressing current limitations in via etch, insulation/barrier/seed layers, and...