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While the COVID-19 pandemic has continued to cause mass disruption to the global economy during the past year, one notable bright spot has been within the semiconductor industry, where fab spending in new process equipment reached a new record high of more than $100B according to SEMI. This spending growth...
Meet Trymax’ most flexible Plasma Ashing system for running critical low-temperature descum processes and high-temperature bulk photoresist strip processes. These steps are crucial for the manufacturing of high-performance accelerometers and gyroscopes used in consumer, automotive and industrial applications. Our NEO 2000 system prepared for MEMS manufacturing is the latest photoresist...
Severine Cheramy has devoted her career to developing 3D integration technologies and bringing them to market. She was the first person to show me what a TSV wafer looked like when I visited CEA-Leti’s cleanroom in 2009 during my Tour de France in 3D. At the time, she was a...
Continuing from Part 1: On Thursday morning I really enjoyed the Monolithic 3D session. Francoise already reported about it, so I can be brief and focus on the most advanced program presented, the CEA Leti CoolCube™ . Olivier Billoint showed and explained how Leti, in cooperation with an EDA partner, is...
Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today introduced the Superfast 4G high-volume, in-line, 3D topography inspection system. Ultratech’s new 4G system builds on the field-tested capability of the Superfast 3G, providing the industry’s highest-productivity and lowest-cost...
Another early start (5:30am) to catch the train to Grenoble. The trains went on strike (a regularly scheduled occurrence) but lucky for me, the strike didn’t affect trains running before 8am. (I love France. They’re so civilized here…) As I wasn’t scheduled to meet with the team from Soitec until...
Ziptronix Inc., the leading developer of direct bonding technology for advanced semiconductor applications, announced today that recent collaborations with major image-sensor manufacturers have shown that the Ziptronix ZiBondTM direct bonding process contributes minimum distortion in backside illuminated (BSI) image sensors. “In addition to confirming that the Ziptronix direct bonding technology
It’s hard to believe I’ve been at this for a almost a year.
As the old saying goes, things usually happen in threes… and in this case 3D. Three years ago, EV Group (EVG) teamed up with Brewer Science, Inc. (BSI) to develop temporary wafer bonding and debonding processes using EVG tools and BSI's materials. Just a few weeks ago, CEA Léti...
Inquiring minds want to know: who is going step forward and claim ownership of post-fab processes for 3D IC stacking using through-silicon vias (TSVs)? This has been a topic of debate for some time, with no real solution, although plenty of reasons why one or the other is the way...
