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May member news showcases significant strides in advancing semiconductor technologies and fostering sustainability efforts. From strategic divestitures and innovative product launches to educational initiatives and workforce development programs, the semiconductor industry continues to evolve and thrive. Dive into the latest updates from our member companies and stay informed about the...
In order to remain competitive in the Internet-of-Things (IoT) environment, medium-sized industrial and process measurement technology companies must increasingly integrate their sensor circuits on ASICs (Application Specific Integrated Circuits). The semiconductor industry is currently meeting this need with lower costs for development processes and lower thresholds in terms of production...
Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November 13, 2019, two well-known industry experts, Anand Joshi and Tom Dillinger, addressed today’s hot topics —neural networks and System-on-Chip (SoC) design challenges — with short, but very informative presentations. Can...
FLORIAN, Austria, June 21, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that, for the fourth successive year, it has earned all three awards resulting from VLSIresearch Inc.’s annual Customer Satisfaction Survey. For 2016, EVG was ranked...
Flanders, New Jersey (August 11, 2014)—Rudolph Technologies, Inc. announced today that it has received a large order from one of Taiwan’s providers of independent semiconductor manufacturing services in assembly and test (OSAT) for 2D/3D inspection systems. The order includes: multiple NSX® systems for two-dimensional (2D) macro defect inspection, the Wafer...
ST. FLORIAN, Austria, February 11, 2014 — EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing (HVM)—the EVG150XT resist coating and developing system. Leveraging EVG’s XT Frame...
Because I interact with people involved in 3D across the entire spectrum of its meaning, I tend to be privy to varied perspectives and opinions when it comes to the adoption of TSV as a method of interconnect for 3D integration. One thing is perfectly clear – support for TSV...
While it was Good Friday for most, it was 3D Friday for those of us who attended the 19th Annual Electronic Design Process Symposium (EDPS), held last week in Monterey CA. What an amazing location! For an ocean-starved desert dweller like me, it was hard to tear my eyes off...
I just finished putting together a presentation for the upcoming BiTS Workshop March 7-10, 2010 taking place in my backyard in Mesa, AZ.
As I was unable to attend Design Automation Test in Europe (DATE 2009) myself, but felt the information being shared there would be useful to my readers, I asked fellow 3D enthusiast, Yann Guillou, new technology marketing, St Ericsson, if he would write a guest post for “Françoise in 3D”....
