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While the COVID-19 pandemic has continued to cause mass disruption to the global economy during the past year, one notable bright spot has been within the semiconductor industry, where fab spending in new process equipment reached a new record high of more than $100B according to SEMI. This spending growth...
MILPITAS, Calif. — July 13, 2021 — Global sales of semiconductor manufacturing equipment by original equipment manufacturers are forecast to surpass $100 billion next year, a new high, after jumping 34% to $95.3 billion in 2021 compared to $71.1 billion in 2020, SEMI announced today in releasing its Mid–Year Total Semiconductor Equipment...
Meet Trymax’ most flexible Plasma Ashing system for running critical low-temperature descum processes and high-temperature bulk photoresist strip processes. These steps are crucial for the manufacturing of high-performance accelerometers and gyroscopes used in consumer, automotive and industrial applications. Our NEO 2000 system prepared for MEMS manufacturing is the latest photoresist...
Vantex™ redefines high aspect ratio etching with new innovations in technology and Equipment Intelligence® enabling chipmakers to progress 3D NAND and DRAM roadmaps FREMONT, Calif., Jan. 27, 2021 (GLOBE NEWSWIRE) – Lam Research Corp. (Nasdaq: LRCX) today announced Vantex™, the latest in dielectric etch technology designed specifically for Sense.i™, the most intelligent...
Severine Cheramy has devoted her career to developing 3D integration technologies and bringing them to market. She was the first person to show me what a TSV wafer looked like when I visited CEA-Leti’s cleanroom in 2009 during my Tour de France in 3D. At the time, she was a...
Wilmington, Mass. (November 1, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the availability of its NovusEdge™ system for edge, notch and backside inspection of unpatterned wafers. The company plans to ship multiple systems totaling more than $3M by year end to fill existing orders from two customers. The new system is...
Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today introduced the Superfast 4G high-volume, in-line, 3D topography inspection system. Ultratech’s new 4G system builds on the field-tested capability of the Superfast 3G, providing the industry’s highest-productivity and lowest-cost...
Redesigned, Fully Automated Modular System Integrates Unmatched Spray Coating Processes for MEMS, Compound Semiconductors and Advanced Packaging SEMICON TAIWAN, Taipei, September 4, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation EVG150 automated resist...
Ziptronix Inc., the leading developer of direct bonding technology for advanced semiconductor applications, announced today that recent collaborations with major image-sensor manufacturers have shown that the Ziptronix ZiBondTM direct bonding process contributes minimum distortion in backside illuminated (BSI) image sensors. “In addition to confirming that the Ziptronix direct bonding technology
SUSS MicroTec and IMEC have entered a joint development program to develop permanent bonding, temporary bonding and debonding processes for 3D system integration, including through-silicon-via (TSV) manufacturing.
