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Onto’s JetStep® lithography and Firefly® G3 inspection systems offer a powerful solution as the industry pursues glass core panel transition Wilmington, Mass., July 9, 2024 – Onto Innovation Inc. (NYSE: ONTO) today announced Onto Innovation’s glass substrate suite featuring the JetStep® X500 panel-level packaging lithography system with hybrid substrate handling...
Until recently, many companies considered diversity a “nice to have.” Companies supported diversity and inclusion because they wanted to be good citizens because it was the right thing to do, and – for some, cynically – because it was good PR. But now research is proving the business case for...
Artificial intelligence and machine learning (AI/ML) can have various applications in smart manufacturing for semiconductor fab, advanced packaging, and electronics manufacturing, and it typically involves several key elements: sensing, connectivity, predicting, and control. As recognized by many industry organizations, smart manufacturing matures through several levels: reactive, preventive, predictive, and autonomous...
ERS electronic, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is appointing Joshua Zhou as Vice President. Zhou joined the company as Sales and Marketing Director in 2018 when ERS opened its China sales office in Shanghai. Joshua has more than twenty years of experience in...
Who was Madeline on Halloween? Before we start more tech coverage of IMAPS 2018 with a look at polymer dielectric advancements, long time readers know that you are due a Halloween update on my granddaughters. This year I’m focusing on Madeline who will be eleven in February. Her Halloween disguise...
Wafer and panel-level packaging (WLP/PLP) offers technical and business advantages, compared to traditional IC packages. These cost-effective packaging solutions attracted more than 800 industry experts to the International Wafer Level Packaging Conference (IWLPC 2018) in San Jose’s DoubleTree Hotel at the end of October. In case you were wondering, a...
The message remains consistent: following Moore’s Law is no longer economical for most IC designs. A major part of the IC value creation is moving from the die to the IC package. Now advanced packaging technologies and materials enable combining multiple dies with heterogeneous functions as well as high-quality passives...
Structured light and time of flight (ToF) are the dominant types of 3D sensing used for augmented reality, motion detection, gesture control, automotive/industrial 3D mapping, and proximity applications. These 3D sensing technologies are now appearing in smartphones. Apple’s iPhone X and its Face ID technology was not the first smartphone...
Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into product and market details, allow me to share some of my general impression of this, as usual, very well-organized event. After several decades of experience...
I don’t know why it still surprises me to read conflicting reports on the progress of 3D TSVs. But I think Ron Huemoeller, Amkor, finally hit on it in his closing remarks during today’s webcast, “TSV Packaging at the Tipping Point”, moderated by Pete Singer, Solid StateTechnology/Extension Media. Huemoeller’s presentation and...
