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Experience higher integration density and improved performance through hybrid bonding techniques Brewer Science, Inc., a pioneer in temporary bonding and materials for the semiconductor industry, is presenting Materials for Hybrid Bonding at IMAPS Symposium 2024 on October 1st, 2024 at 1:15 pm (EST). Challenges for High-Temperature Processing in Semiconductor Packaging Traditional high-temperature processing poses...
SAN JOSE, Calif.—July 10, 2024—Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and media technology sectors to market, was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on...
As the company boasts some of the most advanced plasma equipment in the industry, CCO Peter Dijkstra discusses how Trymax Semiconductor Equipment B.V. (Trymax) has achieved this unique position. Amongst many titans of the semiconductor manufacturing industry in the Netherlands, Trymax Semiconductor Equipment B.V. (Trymax) is the company of choice...
Melville, NY (July 1, 2021) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications, today announced the acquisition of Semi Dice, LLC (“Semi Dice”), a global provider of high-reliability die & wafer products and value-added services. The...
EVG achieves ranking among THE BEST Suppliers to Foundation Chip Makers for the first time in survey results; continues win streak with 18th consecutive year listed among “THE BEST” suppliers EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today...
PROPHESEE Joins IRT Nanoelec 3D Integration Program Will Work with CEA-Leti, STMicroelectronics, Mentor, EVG, and SET to Develop New 3D Event-Based Vision System GRENOBLE, France – Oct. 14, 2019 – PROPHESEE, the inventor of the world’s most advanced neuromorphic vision systems, joins the IRT Nanoelec consortium to help broaden the...
A few weeks ago, Tezzaron announced its latest industry first: an eight-layer 3D IC wafer stack containing active logic, built at its fab, Novati Technologies, a global nanotechnology development center located in Austin, TX. Novati is clearly on a roll, because today they added another industry first to their product...
When 3D integration has been discussed in the past, whether in terms of a true 3D IC stack or an interposer-based design, the cost of 3D ICs has not always been part of the discussion. In the past couple of years, as 3D ICs have moved closer to reality, more attention...
Metrology, process control, and electrical test are key enablers for the success of the semiconductor industry. 3D integration using TSVs offers new challenges in this area that need solutions. There seems to be industry consensus that it is extremely difficult to perform a wafer-level test that ensures the complete functionality of...
Semicon Taiwan, Taipei, September 4, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via (TSV) semiconductor packaging applications. Available on the EVG100 series of resist processing systems, the new...
