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Nordson Test & Inspection today announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry. The event will take place from September 4-6, 2024 at TaiNEX Hall 1 and 2, Taipei, Taiwan. In booth #L0516, the company will be showcasing its state-of-the-art inspection and...
SAN JOSE, Calif.—July 10, 2024—Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and media technology sectors to market, was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on...
Expanded collaboration includes installation of EVG’s LITHOSCALE® maskless exposure system, EVG®7300 UV-NIL system and complementary resist processing systems FLORIAN / GRAZ, Austria, November 13, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Silicon Austria Labs (SAL), Austria’s leading...
EVG achieves its highest rankings ever with 5 Star ratings across all applicable award categories; continues winning streak with 21st consecutive year listed among “THE BEST” suppliers ST. FLORIAN, Austria, June 27, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and...
Partnership will leverage firms’ respective heterogeneous-integration proficiencies to focus on development and optimization of full process-integration schemes for diverse high-density pixel array applications Kalispell, Mont. – June 2, 2022 – ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it is...
Melville, NY (July 1, 2021) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications, today announced the acquisition of Semi Dice, LLC (“Semi Dice”), a global provider of high-reliability die & wafer products and value-added services. The...
SPTS Technologies has launched its low temperature plasma-enhanced chemical vapor deposition (PECVD) solution for via-reveal passivation in 3D-IC packaging applications. Already proven in 300mm volume production fabs, the Delta fxP® PECVD system deposits dielectric layers onto bonded substrates at wafer temperatures below 200°C, with throughputs up to twice that of...
This week’s webinar on chip stack assembly simulation, presented by Kamal Karimanal of Cielution offered some useful information on how modeling can be used to minimize warpage in 3D stacking. In 3D stacking, versus traditional flip chip processes, thickness of RDL layers in comparison with the thinned die or wafer can lead...
SEMI announced today the formation of a Three-Dimensional Stacked Integrated Circuits (3DS-IC) Standards Committee. 3DS-ICs are composed of a stack of two-dimensional die, and are viewed as critical in helping the semiconductor industry keep pace with Moore’s Law. Current integration methods like wirebond and flip chip have been in production...
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH’s 3D interconnect program based at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex outlined new developments in wafer bonding, copper removal, and wafer thinning at the 2010...
