Matches for your search: "fan-out wafer level packaging "
Artificial intelligence (AI) is driving the need for faster processing speeds to keep up with the large language models. As a result, we see multi-reticle packages using 2 x 800 mm2 chips in production in a single package. These larger chip sizes and the need for better yields and higher...
SEMICON Taiwan is arguably the most influential semiconductor event in Taiwan, reaching records high in terms of scale in its 27 years of history, attracting 700 exhibitors, using a total of 2,450 booths, and organizing more than 20 international forums. This year it will spotlight eight key industry themes: advanced...
Siemens has collaborated with leading Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries Co., Ltd. (SPIL) – (Image courtesy of SPIL) Siemens Digital Industries Software today announced it has collaborated with leading Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries Co., Ltd. (SPIL) to develop and implement a...
One of the most popular booths at the recent IMAPS DPC was that of wafer-level fan-out technology provider, Deca. Their black tee shirts state “SHIFT HAPPENS” on the front and on the back say, “We clean it up” (referring to their adaptive patterning of course). Also of great interest was...
Nepes Laweh corporation announced the successful production of the world’s first 600mm x 600mm large Panel Level Packaging (PLP) using Deca’s M-Series™ fan-out technologies. Nepes Laweh had a grand opening of the Cheongan Campus PLP Line on December 7th with the presence of the Minister of Trade, Industry and Energy,...
One of the hottest trends in semiconductor manufacturing today is wafer-level packaging (WLP). According to Allied Market Research, the global WLP market size is expected to reach $7.8 billion by 2022, registering a compound annual growth rate (CAGR) of 21.5% from 2016 to 2022. Broadly defined, WLP encompasses different integration...
SEMICON China attracts the world’s leading technology companies who design, develop, manufacture, and supply the technologies to manufacture the microelectronics that drive today’s most sophisticated consumer and commercial electronic products. Many of our 3D InCites community members are exhibiting and/or presenting during the show. Here is a preview of what...
2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM), FOWLP volumes significantly increased in magnitude. Will this strong momentum...
KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP™ and ICOS® T830. Designed for characterization and monitoring of the diverse processes used in wafer-level packaging, CIRCL-AP enables all-surface wafer defect inspection, review and metrology at high throughput. The ICOS T830 provides fully automated optical...
Follow-on Order Demonstrates the Strength of EVG’s High-volume Manufacturing Solutions for Wafer-level Camera Applications
