Matches for your search: "fan-out wafer level packaging "
Artificial intelligence (AI) is driving the need for faster processing speeds to keep up with the large language models. As a result, we see multi-reticle packages using 2 x 800 mm2 chips in production in a single package. These larger chip sizes and the need for better yields and higher...
Siemens has collaborated with leading Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries Co., Ltd. (SPIL) – (Image courtesy of SPIL) Siemens Digital Industries Software today announced it has collaborated with leading Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries Co., Ltd. (SPIL) to develop and implement a...
One of the most popular booths at the recent IMAPS DPC was that of wafer-level fan-out technology provider, Deca. Their black tee shirts state “SHIFT HAPPENS” on the front and on the back say, “We clean it up” (referring to their adaptive patterning of course). Also of great interest was...
Nepes Laweh corporation announced the successful production of the world’s first 600mm x 600mm large Panel Level Packaging (PLP) using Deca’s M-Series™ fan-out technologies. Nepes Laweh had a grand opening of the Cheongan Campus PLP Line on December 7th with the presence of the Minister of Trade, Industry and Energy,...
Heterogeneous integration (HI) is fast becoming a key driver of semiconductor development due to its ability to scale the number of individual chips onto a miniaturized system-in-package that enhances functionality, achieves higher efficiency, and even reduces power consumption. At the recently concluded SEMICON CHINA 2021 Advanced Packaging Forum, Dr KK...
SEMICON China attracts the world’s leading technology companies who design, develop, manufacture, and supply the technologies to manufacture the microelectronics that drive today’s most sophisticated consumer and commercial electronic products. Many of our 3D InCites community members are exhibiting and/or presenting during the show. Here is a preview of what...
Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer solvent, wet process tool and its AP300™ lithography system to support the growth of its outsourced assembly and test (OSAT) business. One of the first independent wafer bumping service providers...
2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM), FOWLP volumes significantly increased in magnitude. Will this strong momentum...
KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP™ and ICOS® T830. Designed for characterization and monitoring of the diverse processes used in wafer-level packaging, CIRCL-AP enables all-surface wafer defect inspection, review and metrology at high throughput. The ICOS T830 provides fully automated optical...
Follow-on Order Demonstrates the Strength of EVG’s High-volume Manufacturing Solutions for Wafer-level Camera Applications
