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small business perspective of the Chips Act

IFTLE 581: The National Advanced Packaging Manufacturing Program

As IFTLE has explained previously, Investments in semiconductors will not succeed without investments in advanced packaging. The CHIPS for America program, agreeing with this premise, has announced that it will support the development of advanced packaging technology in the United States that can be transferred to manufacturing facilities, including recipients...

This. Is. Community.

2023 was a year of growth and change for 3D InCites, as well as me personally. In April, I left my role at Kiterocket and the security of a salary and benefits to follow my passion and focus full-time on supporting the 3D InCites Community. It was time, and I...

Trillion Transistors at IEDM

IEDM 2023: The Trillion Transistor Dilemma

It all depends upon who you talk to at IEDM 2023. The semiconductor chip industry is either moving into a new realm that will be based upon chiplet technology, or the industry is continuing to drive front-end and backend technology forward and the two technologies are morphing together to drive...

Amkor Technology Submits Net Zero Goal to Science Based Targets Initiative (SBTi)

TEMPE, Ariz. – Dec. 12, 2023 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, announced today that it has committed to achieving net zero greenhouse gas emissions by 2050. The net-zero goal aligns with the rigorous standards set by the Science Based Targets initiative (SBTi),...

Will 3D Heterogeneous System Integration Help Scale the ESG Wall?

At SEMICON Europa 2023, we heard more good news about 3D heterogeneous Integration from speakers at the CEO Summit and the Advanced Packaging Conference. Not only has it become the champion for the continuation of Moore’s Law scaling, but it also allows us to deliver on power performance area and...

IMAPS San Diego Community Member Preview

The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This year’s symposium will feature five technical tracks, professional development courses and an interactive poster session. The technical program spans three days of sessions with emphasis on SiP/Design/Manufacturing Optimization; Wafer Level/Panel...

ASMC 2024 Call for Abstract Submissions Opens

MILPITAS, Calif. — September 11, 2023 — The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is now accepting abstract submissions for its 2024 event, May 13-16, in Albany, New York. ASMC 2024 will feature technical presentations of more than 90 peer-reviewed manuscripts on advanced semiconductor manufacturing along with keynotes, a...

Lam Research Recognizes 2023 Supplier Excellence Award Winners

FREMONT, Calif., Sept. 7, 2023 /PRNewswire/ — Lam Research Corp. (Nasdaq: LRCX) today announced the honorees of its 2023 Supplier Excellence Awards, recognizing 12 companies across several categories whose close collaboration helped Lam drive a resilient, scalable supply chain to meet its customers’ needs. “At a time when semiconductors have never been more critical, having...

2024 Adele Hars Award for DEI Finalists

2024 Adele Hars Award for DEI Finalists The Adele Hars Award for Diversity, Equity, and Inclusion recognizes a company in the semiconductor and microelectronics industries demonstrating best practices to provide a workplace where diversity, equity, inclusion, and belonging are paramount. Formerly known as the SemiSister Award for DEI, the award...