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SEMICON Europa 2022 Member Preview

SEMICON Europa kicks off next week as microelectronics experts and visionaries gather for insights into advanced technologies that are driving industry growth and critical issues such as sustainability, mobility, healthcare, workforce development and supply chain management. We are excited to connect with our community members and industry friends and look...

Community Member Monthly Highlights – September

Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth sharing from the month previous. If we missed you this month, be sure to add us to your distribution list, we don’t want to leave anyone out. Our community members...

KLA Announces Plans to Build a New R&D and Manufacturing Facility in Newport, Wales

MILPITAS, Calif., Sept. 29, 2022 /PRNewswire/ — KLA Corporation (NASDAQ: KLAC) has announced plans to build a new research-and-development (R&D) and manufacturing center for the SPTS division, in Newport, Wales, UK. The new development designed to meet BREEAM standard of sustainability rating of excellent is expected to include a capital...

Henkel Unveils Semiconductor Capillary Underfill for Advanced Silicon Node Flip Chip Applications

Highly-filled, fast-flow material balances reliability and processability, extends company’s package-level underfill leadership with multi-format solutions SEOUL, South Korea, Sept. 14, 2022 /PRNewswire/ — Henkel today announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications. The material, Loctite EccobondUF 9000AG, enables advanced silicon (Si) node...

U.S. Chips Funding

What You May Have Missed In The CHIPS and Science Act

We’ve had several clients in both the semiconductor and sustainability spaces this week giving a variety of opinions on how the CHIPS and Science Act of 2022 – now formally signed into U.S. law – might affect their business. CHIPS stands for Creating Helpful Incentives to Produce Semiconductors. The act...

ECTC 2022 Member Preview — Stacked and Packed

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. About 1,500 professionals from the global microelectronics packaging industry are set to gather next week...

ERS electronic Announces the AC3 Fusion Thermal Chuck System

AC3 Fusion is a versatile and more sustainable solution for temperature test in wafer probing MUNICH, APRIL 22nd, 2022 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing an extension of the renowned AC3 thermal chuck system, called Fusion. The system...

Contributing to a Greener Semiconductor Industry

Recently we read an interesting article here on 3D InCites about the role secondary markets play in contributing to a greener semiconductor industry. Did you know that the secondary market for semiconductor tools comprises nearly 10% of the overall equipment market? We want to dig a little bit deeper into this topic and...

Yearbook Cover Story: Looking Ahead to Inspire the Innovators of the Future

A Conversation with KLA’s Lena Nicolaides 2021 was a big year for the semiconductor industry, and 2022 is expected to be even bigger. Ironically, despite the mayhem it caused, the chip shortage and its impact on the global supply chain turned out to be the best advertising we could have...