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Francoise von Trapp to Speak on Heterogeneous Integration at MicroTech 2021

Francoise will be presenting A Sustainable Future Requires Heterogeneous Integration at MicroTech 2021, the Annual IMAPS-UK Conference. Session 5 at 3:15pm Abstract: In September 2015, 193 member states of the UN adopted 17 new sustainable development goals (SDGs) to make our world more prosperous, inclusive, sustainable, and resilient. As a...

Looking Back on 2020 and Moving Forward into 2021

COVID-19 hit the world in early 2020 with very little warning. The semiconductor industry was poised for recovery, and all market indicators pointed to solid growth. For many of us, reality hit with the announcement that SEMICON Korea was canceled the day before it was set to start. Soon after,...

ITPC 2020: Hawaii How We Missed You!

The International Trade Partners Conference (ITPC 2020) was held virtually this year. The Tradewinds of Hawaii were missed, as well as the beach and personal interaction. SEMI did a good job developing relevant topics for leaders of companies in the time of geopolitical, geo-technical tensions, as well as creating content...

What to Expect at Virtual SEMICON West 2020

This feels weird, folks. For the first time in 15 years, I didn’t board a flight bound for SEMICON West on the Monday after July 4th.  That was expected since the dates got pushed out by two weeks this year. But now that the event will be held virtually, I’m...

IEDM 2019: Innovative Devices for an Era of Connected Intelligence

The IEEE International Electronic Devices Meeting (IEDM) been one of my favorite conferences for many years. Early in my career, I worked with Roger Haken at Texas Instruments on some of the work he published on materials for trench DRAM. Later on, the papers presented at IEDM helped me help...

SEMICON West Keynotes Look to a Future Beyond Moore’s Law

In addition to Francoise’s post about technology megatrends here, below is part one of my perspective, mostly about the SEMICON West keynotes. Design and Manufacturing Are Finally Combining From July 9-11, many IC manufacturing experts came together at SEMICON West in San Francisco’s very nicely renovated Moscone Center. As an industry...

Extending Moore’s Law through Advanced Packaging

The performance and productivity of microelectronics have increased continuously over the last 50 years due to the enormous advances in lithography and device technology. Today, these technologies are becoming prevalent in 3D packaging, which further enables advances in integrating various technologies (logic, memory, RF, sensors, etc.) in a small form...