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Almost four years ago, we published an article titled “CoolCube™: A True 3DVLSI Alternative to Scaling” on 3D InCites. It described the concept of stacking layers of transistors sequentially on top of each other and documented the research effort happening at Leti to develop a feasible process integration scheme and...
Creating smart cities while also protecting the personal data of its citizens is no easy task these days, particularly with growing public awareness and concern about how their data is being used and shared. It’s become a challenge particularly in Europe, where urban designs lend themselves well to smart city...
How can the Internet of Things change the future of the average citizen? To answer this question, imec joins forces with the City of Antwerp and the Flanders region to turn Antwerp into a Smart City Living Lab in which businesses, researchers, local residents and the city itself will experiment...
In past years, we have provided 3D InCites readers with a guide for navigating through the myriad programs that specifically address 3D integration and packaging at SEMICON West. This year, as SEMI has discovered, everything has changed; and thus they themed SEMICON West 2016, “Definitely NOT business a usual.” As...
To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies. Leaders in the advanced packaging industry have identified new solutions enabling more and more functionalities to be integrated along with many devices in the same...
MARLBOROUGH, Mass. – Nov. 17, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that its SOLDERON™ BP TS 6000 Tin-Silver plating chemistry has received a prestigious R&D 100 Award, recognizing it as one of the top 100 innovations of the past year....
Last time I checked in with Kim Pollard, Technology Manager, Dynaloy, was a few years ago, when we talked about the importance of cleans for 3D ICs. Dynaloy, a subsidiary of Eastman Chemical Company, develops and creates chemistries specifically for the removal of photoresist, etch residues and other polymers. At...
The 65th annual Electronics Technology Components Conference (ECTC 2015) logged record numbers (over 1500 attendees, 20% increase over last year) as the entire semiconductor industry recognizes (finally) that there is indeed money to be made in the advanced packaging sector. The flip chip and wafer level packaging sessions were full to...
ECTC 2015 returns to my favorite of its three rotating locations at the Sheraton San Diego Hotel and Marina almost exactly one month from now, May 26-29, 2015. This year, the ECTC technical committee has selected 350 papers on topics related to 3D and TSV technologies, wafer level packaging, electrical and...
MARLBOROUGH, MA – April 27, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry was honored as a Bronze 2015 Edison Award winner in the Material Science: Manufacturing category. Removing lead from solders used...
