3D InCites Awards Program Recognizes Henkel Leadership in Die Attach and Underfill Materials Development
Henkel semiconductor packaging innovations earn Material Supplier of the Year Award Irvine, CA – Henkel today announced that it has earned the Material Supplier of the Year distinction from the 3D InCites community as part of its recent 3DInCites Awards program. The Henkel nomination highlighted the company’s launch of several...