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Nordson TEST & INSPECTION today announced plans to exhibit at SEMICON West 2024, scheduled to take place July 9-11 at the Moscone Center in San Francisco, California. Visitors to booth 1233 will be able to see demonstrations of Nordson’s WaferSense® semiconductor sensors, Quadra Pro™ Manual X-Ray System (MXI), and Gen...
SAN FRANCISCO – July 10, 2023 – SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at SEMICON West 2023, July 11-13 at the Moscone Center in San Francisco. The Best of West Award winner will be announced at SEMICON West 2023 on Thursday, July 13....
Would you buy your next hotdog in parts, from un-coordinated suppliers? For example: Get the bun from a baker, the sausage from a butcher, mustard and/or ketchup and veggies from the nearest supermarket…? If yes, you may find the sausage being too small, the veggies too big for the bun,...
Every year at SEMICON West, in addition to taking in keynotes and technology sessions, I like to catch up with semiconductor suppliers to find out about any significant news, their latest offerings and how they are enabling next-generation manufacturing. Here are this year’s highlights. UnitySC One of the big stories...
No SEMICON West would be complete without a few laps around Moscone North and South, and some one-on-one chats with suppliers. I stopped in to see several semiconductor supplier companies who annually request an audience with the Queen of 3D to talk about their latest accomplishments, as well as gain...
I almost didn’t attend the keynote panel titled, Scaling the Walls of Sub 14nm Manufacturing, at SEMICON West last week, because in my experience as a blogger/journalist focused on advanced packaging, interposer integration and 3D ICs, discussions on scaling rarely talk about packaging. In fact, up until now, it’s been...
With the continued innovations in packaging technologies and 2.5D interposers pushing 3D ICs further out from one end, and 16/14nm nodes already qualified without TSVs, making us wait until 10nm, are 3D ICs suddenly getting the squeeze from both sides? That’s one theory I took away from all the conversations...
Xcerra™ Corporation announced that Dave Tacelli will join the panel discussion “Testing into the Future” at SEMICON West, scheduled to take place July 8 to 10 in San Francisco. The panel discussion will be part of the TechXpot North session “Seeking Growth” on Tuesday, July 8, 2014 from 10:30 am...
We have a guest contribution from Zvi Or-Bach, the President and CEO of MonolithIC 3D Inc. Zvi adds information to his previous blog post: Dimension Scaling and the SRAM Bit-Cell. I just downloaded the ASML presentation from Semicon West2013 site – ASML’s NXE Platform Performance and Volume Introduction. Slide #5...
Company to share key developments and highlights at SEMICON West
