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It’s been a busy time on the semiconductor industry front: SEMICON Taiwan; Intel’s Innovation Day; glass interposers making it to center stage; TSMC’s Open Innovation Platform with the announcement of the 3Dblox 2.0; and the first CHIPS Act payout by the Department of Defense (DoD) of $238 million to universities....
The SEMI year ends with Semicon Japan and kicks off with SEMI’s Industry Strategy Symposium. The 2023 ISS was the return to the normal schedule with the 2022 event having been held in April. At the 2022 event, the big news was the semiconductor chip revenues being forecast to top...
Hello, I am Mandy Perdok. I am 20 years old and live in Milsbeek in the Netherlands. My hobbies include playing Netball (Team Sport), training/coaching the Netball youth team, and traveling. As a third-year student majoring in Chemical Engineering at the Fontys Hogeschool Eindhoven of Applied Science, I am completing...
Happy Holidays! Here’s the last of our community news round-up for 2022. Can’t wait to see what’s in store for the New Year. Siemens Digital Industries Software announced that its Sokol™ Flex OS software now supports RISC-V embedded development with the availability of one of the industry’s first commercially supported,...
I have a confession to make. Last March – we’re talking March of 2023 at IMAPS DPC – Beth Keser, IMAPS president, presented me with a signed copy of the book she co-edited with Steffen Khröhnert – Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces:...
ST. FLORIAN, Austria, November 7, 2022—EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has strengthened its portfolio of optical lithography solutions with the unveiling of the next-generation 200-mm version of its EVG®150 automated resist processing...
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth sharing from the month previous. If we missed you this month, be sure to add us to your distribution list, we don’t want to leave anyone out. Our community members...
IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D stacking EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced NanoCleave™, a revolutionary layer release technology for silicon...
I’ve started so many event blog posts since the return of live events with the phrase – it’s good to be back! But it bears repeating. And with ECTC 2022 weighing in with record attendance at about 2000 attendees, it’s clear that we are all pretty much done with virtual...
Tech company recognizes Asia presence is crucial to continuous growth Taipei, Taiwan–November 28, 2021– Brewer Science, a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, commemorates the 20th Anniversary of establishing its first Asia location, now one of five Brewer Science offices...
