IFTLE 438: Reliability Test For 0.3mm WLCSP; Copper RDL Trace Requirements
This week we continue our look presentations from SEMICON Europa’s Advanced Packaging Conference. Intel’s Reliability Test Beth Keser’s group at Intel Germany discussed their “product-on-board” reliability test for 0.3mm WLCSPs. The existing JEDEC/IPC board-level methodology tests are fine for traditional packaging solutions for non-extreme low K dielectric (ELK) fab nodes....