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Customers have asked and suppliers are listening. One sign of progress from last year to this year at SEMICON Singapore’s 3D IC Forum was the number of supplier presentations focused on process improvements that have been developed to lower the 3D IC cost of ownership (CoO). In addition to the...
While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB) to be an unsolvable challenge that adds unnecessary cost. The solution? Find a way to do away with it altogether. During the 3D IC Forum at SEMICON Singapore, both A*STAR...
If, as we heard at last week’s 3D IC Forum at SEMICON Singapore, that technology challenges and cost are no longer keeping 3D ICs from volume manufacturing, and indeed the key players are ready to go, then what’s it going to take to get this 3D IC adoption party started?...
Garching, March 4, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the DSC300 Gen2 projection scanner today. SUSS MicroTec’s DSC300 platform for wafer sizes up to 300mm is based on the projection lithography technology developed by SUSS...
ST. FLORIAN, Austria, February 11, 2014 — EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing (HVM)—the EVG150XT resist coating and developing system. Leveraging EVG’s XT Frame...
In 2013, SPTS equipment sales into the advanced packaging market grew by 75%. Some of this was due to a resurgence in 3D wafer level packaging (3D WLP); the first-generation 3D that started with CMOS image sensors in the middle of the last decade. This year’s growth was predominantly due...
I’ve been following the progress of wet etch processes for TSV reveal steps, with particular focus on SSEC’s efforts in this area, since I first heard SSEC CTO Laura Mauer present on the topic at the European TSV Summit. At IWLPC 2013, I caught up with SSEC’s VP of Marketing,...
Recent signs that we’re getting closer to commercialization of 3D ICs? For one, analog and sensor IC company, ams AG, threw down the gauntlet, announcing it is investing more than €25M ($33M) to add manufacturing capacity for 3D ICs in its fab located near Graz, Austria. Analog 3D ICs featuring...
At last week’s Memcon 2013, which took place Tuesday, August 6, 2013, at the Santa Clara Convention Center, Keynoter Bob Brennen, Senior VP at Samsung, talked about the need for New DRAM and Flash Memory architectures. Richard Goering summarized Brennan’s keynote very well in his blog post. Because Brennan’s responsibility...
A few weeks ago I spoke with SPTS’s David Butler, after he participated in the SEMICON Singapore 3D IC panel. We talked a lot about the importance of wafer planarity for performing backside processes like TSV reveal. Butler commented that regardless of a tool’s calibrated precision, its only as good...
