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Nordson Test & Inspection today announced that its SpinSAM Acoustic Microimaging (AMI) system has been honored with the prestigious 2024 Global Technology Award in the test equipment category. The award was announced at a ceremony during SMTA International. The new SpinSAM AMI system sets a new benchmark in the industry...
October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance production capabilities to impactful industry events fostering collaboration and engagement, our members have truly been at the forefront of progress. Additionally, new partnerships have emerged, driving innovation in technology and...
Department of Commerce Announces Grants Across Nine States Highlight Thriving U.S. Semiconductor Industry Today, the Biden-Harris Administration awarded nearly $5 million to 17 small businesses across nine states under the Small Business Innovation Research (SBIR) Program. The SBIR Phase I awards will fund research projects to explore the technical merit...
Onto’s JetStep® lithography and Firefly® G3 inspection systems offer a powerful solution as the industry pursues glass core panel transition Wilmington, Mass., July 9, 2024 – Onto Innovation Inc. (NYSE: ONTO) today announced Onto Innovation’s glass substrate suite featuring the JetStep® X500 panel-level packaging lithography system with hybrid substrate handling...
Earth Day has passed. Companies’ ESP/social responsibility reports are beginning to appear and they have been commenting on their progress in their Q1 earnings report. The early data in the semiconductor and microelectronics segment looks encouraging. The percentage of renewables in their energy portfolio is increasing. Water conservation and water-positive...
Guten Tag! It’s Friday already? I’m not sure where that week went, but I managed to gather some interesting 3D tidbits throughout the course of it. Let’s begin with Sally Adee’s 3D coverage of IEEE’s International Solid-State Circuits Conference that took place in San Francisco this week.
I was happy to share the 3D stage as a contributing editor in this week’s issue of AP Semi-monthly. In fact, I found Yann Gillou’s guide to 3D vernacular: 3D Lingo-Getting it Straight really helpful for sorting out the differences between 3D configurations at the package and IC...
I have to admit that this year at IMAPS Device Packaging Conference, I spent more time attending technical sessions and less time with the exhibitors than I usually do at an industry event. However, I did manage to check in with a few of them to see what their latest...
While TSV developments continue to attract media attention as the rock star technology of 3D integration, it’s important to remember that it’s not the only game in town. As a member of said media, I must admit that it’s easy to get caught up in all TSV all the time,...
I wish I could be everywhere at once, because there are so many events involving 3D coming up well worth attending. Unfortunately short of cloning myself, which I don’t think the world is ready for, there’s no way for me to cover everything. So instead, I’ve come up with an...
