Matches for your search: "SEMICON West"
A few weeks ago I spoke with SPTS’s David Butler, after he participated in the SEMICON Singapore 3D IC panel. We talked a lot about the importance of wafer planarity for performing backside processes like TSV reveal. Butler commented that regardless of a tool’s calibrated precision, its only as good...
There are a couple of notable updates circulating this week involving companies in the 3D space. The first I saw was news from Sony that it has introduced its next-generation CMOS Image sensor they claim is “ the industry’s smallest, CMOS image sensor and camera system”. The image sensor is...
Want to know how to torture a journalist? Invite them to present at a conference but ask them to sign an NDA so they can’t write about it! However, I can say this much: the 3D Program is alive and well at IBM. From IBM Fellow, Subramanian Iyer, I learned...
There are a couple of notable updates circulating this week involving companies in the 3D space. The first I saw was news from Sony that it has introduced its next-generation CMOS Image sensor they claim is “ the industry's smallest, CMOS image sensor and camera system”. The image sensor is...
Ever since I got involved in the world of advanced packaging, and particularly 3D, I’ve had a soft spot for start-ups. Everyone who reads my blog knows that. So it’s no surprise that I’ve had Ziptronix on my radar since the first press tour in 2007. I was impressed by...
First-ever Integration of In-line Metrology with Temporary Bonding/Debonding Enables More Repeatable and Reliable Process, Improved Yields and Lower Cost of Production ST. FLORIAN, Austria, June 21, 2011 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it...
A new film-deposition technology advance from Alchimer S.A.is said to cut fill deposition times and could provide new options for the electronics packaging industry as it struggles to bring through-silicon vias (TSVs) into cost-effective production. Alchimer has disclosed that its AquiVia TSV barrier-layer process has the ability to provide uniform,...
SEMATECH’s story is one that is truly built upon the essence of collaboration. SEMATECH is not a traditional research center. Rather, it is a technology research consortium that exists to serve the best interests of its worldwide members and partners. Originally established in Austin, TX as an experiment in combining...
Just arrived in Tokyo – my first visit to Asia ever. I’m here at the invitation of Paul Werbaneth, of Tegal Corp. to attend a one-day seminar on TSV etch on Tuesday. ( I mentioned this in last week’s 3D InCites InBrief, but the agenda has slightly changed. Presenting companies...
When will I learn that skirts and clean room tours don’t mix? And I always seem to be visiting EVG’s facilities when these situations arise. Yesterday at their Open House in Tempe, it wasn’t a clean room suit incident. It was the waffle floors with upward ventilation that almost caught...
