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2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM), FOWLP volumes significantly increased in magnitude. Will this strong momentum...
Grenoble, France – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced the opening of its global headquarters in Grenoble, France, the heart of the French Silicon Valley. This location strategically positions the company in one of...
Peter Clarke, EE Times, and I both agree – the biggest news of this year’s SEMI MEMS Summit, which took place September 17-18, 2016 in Stuttgart, Germany, was the announcement that SEMI is forming a strategic association partnership with the MEMS and Sensors Industry Group (MSIG). “This is good news, as...
Rudolph continues to drive the technological innovation of its inspection and metrology products to deliver solutions that address the demanding needs across front- and back-end processes Wilmington, Mass. (September 6, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today launched two new inspection and metrology solutions for advanced semiconductor manufacturing: the Firefly™ System...
2015 overall was a mixed year for the materials sector in the electronics market, with a general slowdown in PC-related segments offset by continued growth in mobile smart phones and other handheld devices despite industry growth flattening out late in 2015. In 2016, market forecasts indicate some improved growth and...
Subu: “I find the whole concept of 2.5D fairly atrocious. I have banned its use.” Rao: “what are you going to call it?” Subu: “Interposers, like God intended it to be.” The exchange quoted above took place between Subramanian Iyer, PhD, Director, Systems Scaling Technology IBM, and co-chair of this year’s...
It’s been a long time coming, but Kulicke & Soffa has seen the writing on the wall, and it reads: “2.5D and 3D IC assembly is a hot market.” Why else would the wire-bond giant invest in developing a thermocompression chip-to-substrate (C2S) bonder for high-volume 2.5D and 3D IC die...
Kulicke and Soffa Industries, Inc. announced the introduction of APAMA (Advanced Packaging with Adaptive Machine Analytics), the Company’s new Chip-to-Substrate (C2S) bonder that answers today’s thermo-compression bonding challenges. The APAMA was designed with performance and accuracy in mind, delivering the best-in-class die-stacking solution for 2.5D / 3D or TSV integrated...
Years ago I saw Dr. Wayne Dyer on Public Television. He talked about “The Power of Intention”. The engineering-driven half of my mind didn’t pay much attention to such a mushy topic…. until Dr. Dyer confused me with what sounded like a play on words. He said “When you change...
Customers have asked and suppliers are listening. One sign of progress from last year to this year at SEMICON Singapore’s 3D IC Forum was the number of supplier presentations focused on process improvements that have been developed to lower the 3D IC cost of ownership (CoO). In addition to the...
