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New Multi-Functional Micro- and Nanoimprint Solution from EV Group Offers Unprecedented Flexibility for High-Volume Optical Device Manufacturing

Jan 18, 2022

ST. FLORIAN, Austria, January 18, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®7300 automated SmartNIL® nanoimprint and wafer-level optics system. The EVG7300 is the company’s most advanced solution to combine multiple UV-based process capabilities, such...

IFTLE 477: Is the World Dependent on Taiwan for Chips? SMIC Focus on Packaging

Feb 23, 2021

The World is Dangerously Dependent on Taiwan for Chips The Taipai Times recently published this position paper (written by reporters from Bloomberg) making the point that Taiwan could become the flashpoint between China and the West due to their position in the world economy driven by their chip manufacturing capabilities....

What I’m Thankful for This Thanksgiving

Nov 25, 2020

2020 has been a year for the books. Honestly, between the divisiveness in the USA caused by this year’s election shenanigans, the pandemic surging globally once again, and the disruption it’s caused in all our lives (to put it mildly), it’s been a struggle to find things to be thankful...

ASMC 2016, the Return of MEPTEC Luncheons, and Your May Calendar

May 06, 2016

The Saratoga Springs, NY, horse racing season starts in late July, following a racing tradition that dates to the 1860s. That’s a pretty long run indeed, and it’s one of the things, along with the healing spring waters, successful Revolutionary War battle history, and “summering” by well-to-do Boston and New...

PDN Design, Target Impedance and Path Finding for IC, Package, and PCB

Sep 10, 2015

I am fortunate to work with Prof. Madhavan Swaminathan, Founder, CTO, E-System Design, and inventor of our algorithms. Long ago, as an undergraduate engineering student at University of Illinois focused on integrated circuit (IC) design, I enrolled in the required ElectroMagnetics (EM) course to discover it was all about large...

Micro vs. Macro 3D IC Cost Analysis: Can we learn from the mid 1980’s?

Feb 05, 2015

Amy Palesko from SavanSys Solutions wrote an excellent 3D IC cost analysis article (The Cost of 3D ICs) on 3D InCites that focused on the manufacturing cost of TSV enabled devices. No question that these costs are important and will follow a classical manufacturing learning curve. But the real story...

GlobalFoundries and IBM: Stuck on the Rumor Mill?

Jul 30, 2014

There’s nothing like a little industry gossip to get the juices flowing. I love it when the media churns out news articles based purely on speculation, quoting individuals who request anonymity, and publishing the names and titles of those who refuse to comment on speculation. No doubt you’ve all seen...

Going the Distance in Medical Electronics

Sep 24, 2010

Every once in a while it helps to step back and take a look at the big picture. For me, attending events like this week’s 2010 Medical Electronics Symposium, co-hosted by MEPTEC and SMTA, is one way to do that.  This year’s theme was Successful Strategies for the Medical Electronics...