Packaging, Connecting, and Integrating: 30 years of Fraunhofer IZM – 30 years of packaging and interconnection excellence in microelectronics
September 20, 2023 The Fraunhofer Institute for Reliability and Microintegration IZM is marking its thirtieth year with a high-profile international conference in September. The Institute that now employs more than 400 people at its three sites was founded by twenty-one German scientists on a mission. Its main site in the...