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Guten Tag! It’s Friday already? I’m not sure where that week went, but I managed to gather some interesting 3D tidbits throughout the course of it. Let’s begin with Sally Adee’s 3D coverage of IEEE’s International Solid-State Circuits Conference that took place in San Francisco this week.
Want to know how to torture a journalist? Invite them to present at a conference but ask them to sign an NDA so they can’t write about it! However, I can say this much: the 3D Program is alive and well at IBM. From IBM Fellow, Subramanian Iyer, I learned...
There are a couple of notable updates circulating this week involving companies in the 3D space. The first I saw was news from Sony that it has introduced its next-generation CMOS Image sensor they claim is “ the industry's smallest, CMOS image sensor and camera system”. The image sensor is...
Ever since I got involved in the world of advanced packaging, and particularly 3D, I’ve had a soft spot for start-ups. Everyone who reads my blog knows that. So it’s no surprise that I’ve had Ziptronix on my radar since the first press tour in 2007. I was impressed by...
First-ever Integration of In-line Metrology with Temporary Bonding/Debonding Enables More Repeatable and Reliable Process, Improved Yields and Lower Cost of Production ST. FLORIAN, Austria, June 21, 2011 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it...
A new film-deposition technology advance from Alchimer S.A.is said to cut fill deposition times and could provide new options for the electronics packaging industry as it struggles to bring through-silicon vias (TSVs) into cost-effective production. Alchimer has disclosed that its AquiVia TSV barrier-layer process has the ability to provide uniform,...
SEMATECH’s story is one that is truly built upon the essence of collaboration. SEMATECH is not a traditional research center. Rather, it is a technology research consortium that exists to serve the best interests of its worldwide members and partners. Originally established in Austin, TX as an experiment in combining...
Just arrived in Tokyo – my first visit to Asia ever. I’m here at the invitation of Paul Werbaneth, of Tegal Corp. to attend a one-day seminar on TSV etch on Tuesday. ( I mentioned this in last week’s 3D InCites InBrief, but the agenda has slightly changed. Presenting companies...
When will I learn that skirts and clean room tours don’t mix? And I always seem to be visiting EVG’s facilities when these situations arise. Yesterday at their Open House in Tempe, it wasn’t a clean room suit incident. It was the waffle floors with upward ventilation that almost caught...
While TSV developments continue to attract media attention as the rock star technology of 3D integration, it’s important to remember that it’s not the only game in town. As a member of said media, I must admit that it’s easy to get caught up in all TSV all the time,...
