Matches for your search: "SEMICON West"
Earth Day has passed. Companies’ ESP/social responsibility reports are beginning to appear and they have been commenting on their progress in their Q1 earnings report. The early data in the semiconductor and microelectronics segment looks encouraging. The percentage of renewables in their energy portfolio is increasing. Water conservation and water-positive...
Pulsus™ is the semiconductor industry’s first pulsed laser deposition tool designed for mass production FREMONT, Calif., March 26, 2024 – Lam Research Corp. (Nasdaq: LRCX) today introduced the world’s first production-oriented pulsed laser deposition (PLD) tool to enable next-generation MEMS-based microphones and radio frequency (RF) filters. Lam’s Pulsus™ PLD system delivers aluminum...
Advancing the future of drinking water sensing for real-time detection of contaminants, such as lead, using printed sensors Las Vegas, Nevada – January 9, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will be presenting its newest...
September 20, 2023 The Fraunhofer Institute for Reliability and Microintegration IZM is marking its thirtieth year with a high-profile international conference in September. The Institute that now employs more than 400 people at its three sites was founded by twenty-one German scientists on a mission. Its main site in the...
Large cleanroom and testing lab will serve as the innovation center of excellence for its power delivery solutions for semiconductor devices ATLANTA, Aug. 31, 2023 (GLOBE NEWSWIRE) — Saras Micro Devices announced today that it has completed the build-out of its lab and office space in the Inland Tract property...
Is the Wild West becoming America’s center of microelectronics innovation? Based on the current wave of activity across the semiconductor supply chain, it’s starting to look that way. I’m not just talking about TSMC’s gigafab, or Intel’s expansion, although these industry giants have a lot to do with what’s happening...
SAN FRANCISCO –– July 10, 2023 ––Xpeedic today launched its high-speed digital signal integrity and power integrity (SI/PI) suite with significant features and upgrades to advanced packaging and high-speed design domains as the 60th Design Automation Conference (DAC) opens at Moscone Center West here. The Xpeedic EDA 2023 Suite includes...
I was happy to share the 3D stage as a contributing editor in this week’s issue of AP Semi-monthly. In fact, I found Yann Gillou’s guide to 3D vernacular: 3D Lingo-Getting it Straight really helpful for sorting out the differences between 3D configurations at the package and IC...
I have to admit that this year at IMAPS Device Packaging Conference, I spent more time attending technical sessions and less time with the exhibitors than I usually do at an industry event. However, I did manage to check in with a few of them to see what their latest...
I wish I could be everywhere at once, because there are so many events involving 3D coming up well worth attending. Unfortunately short of cloning myself, which I don’t think the world is ready for, there’s no way for me to cover everything. So instead, I’ve come up with an...
