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73rd ECTC: New Format, New Venue, Amazing Experience!

Preparation for the 73rd ECTC started one year ago and was strongly supported by over 250 experts from 15 countries, members of 10 technical committees. The technical committees critically reviewed 618 submitted abstracts from industry (56.1%) and academia (43.9%), resulting in 369 technical papers. The papers, organized in 41 sessions,...

Mike Manfra, Perdue, presents keynote talk on quantum computing.

ECTC 2023: Quantum Computing, Hybrid Bonding, and the CHIPS for America Act

With over 350 papers in 36 oral sessions and 5 interactive presentations, there was no shortage of content to absorb at the 2023 Electronics Components Technology Conference (ECTC 2023), which took place May 31-June 2 in Orlando, FL. The keynote and panel sessions discussed technical topics including quantum computing, chip-to-wafer...

SVB

Did the SVB Failure Launch Another High-Tech Financial Crisis?

As Silicon Valley Bank (SVB) and Signature Bank failures were happening, I read a Facebook post that commented, 1929 again? I then started thinking about the number of bank and industry crashes that have taken place over time, and closer to home during my career. 1929 sticks with many of...

Sustainability 101: Are Your Products Toxic?

Do you know how many individual elements and chemical compounds are required to make a circuit board? I don’t. There are dozens, perhaps more. The list covers much of the periodic table. Making the semiconductor industry supply chain more environmentally responsible involves considering how we extract, produce, use, and dispose...

New Multi-Functional Micro- and Nanoimprint Solution from EV Group Offers Unprecedented Flexibility for High-Volume Optical Device Manufacturing

ST. FLORIAN, Austria, January 18, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®7300 automated SmartNIL® nanoimprint and wafer-level optics system. The EVG7300 is the company’s most advanced solution to combine multiple UV-based process capabilities, such...

IFTLE 477: Is the World Dependent on Taiwan for Chips? SMIC Focus on Packaging

The World is Dangerously Dependent on Taiwan for Chips The Taipai Times recently published this position paper (written by reporters from Bloomberg) making the point that Taiwan could become the flashpoint between China and the West due to their position in the world economy driven by their chip manufacturing capabilities....

What I’m Thankful for This Thanksgiving

2020 has been a year for the books. Honestly, between the divisiveness in the USA caused by this year’s election shenanigans, the pandemic surging globally once again, and the disruption it’s caused in all our lives (to put it mildly), it’s been a struggle to find things to be thankful...

ASMC 2016, the Return of MEPTEC Luncheons, and Your May Calendar

The Saratoga Springs, NY, horse racing season starts in late July, following a racing tradition that dates to the 1860s. That’s a pretty long run indeed, and it’s one of the things, along with the healing spring waters, successful Revolutionary War battle history, and “summering” by well-to-do Boston and New...

PDN Design, Target Impedance and Path Finding for IC, Package, and PCB

I am fortunate to work with Prof. Madhavan Swaminathan, Founder, CTO, E-System Design, and inventor of our algorithms. Long ago, as an undergraduate engineering student at University of Illinois focused on integrated circuit (IC) design, I enrolled in the required ElectroMagnetics (EM) course to discover it was all about large...