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Expanded collaboration includes installation of EVG’s LITHOSCALE® maskless exposure system, EVG®7300 UV-NIL system and complementary resist processing systems FLORIAN / GRAZ, Austria, November 13, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Silicon Austria Labs (SAL), Austria’s leading...
In a world that is increasingly driven by technological innovation, the semiconductor space stands at the forefront of progress. Our mission is to unite visionaries, thought leaders, and pioneers like you to explore the limitless possibilities and transformative potential that the semiconductor industry holds. Get ready to embark on a...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Dymek Company, an advanced equipment distributor for the semiconductor, biomedical, data storage, photovoltaic and aerospace industries, today announced that they have established a new joint venture company in Malaysia. The new...
Amy Palesko from SavanSys Solutions wrote an excellent 3D IC cost analysis article (The Cost of 3D ICs) on 3D InCites that focused on the manufacturing cost of TSV enabled devices. No question that these costs are important and will follow a classical manufacturing learning curve. But the real story...
While 3D IC production is underway for memory devices, some say demand for 3D ICs is still years away. Could both be right, or are we getting mixed messages? Today’s news from SEMICON Taiwan, in which a DigiTimes reporter quoted Mike Liang, president of Amkor Technology Taiwan as saying that...
There’s nothing like a little industry gossip to get the juices flowing. I love it when the media churns out news articles based purely on speculation, quoting individuals who request anonymity, and publishing the names and titles of those who refuse to comment on speculation. No doubt you’ve all seen...
An industry colleague commented to me recently that the press seems to have lost interest in 3DIC. As probably the industry’s most avid follower and writer of 3D related news, I had to disagree – its not that we’ve lost interest, its just that there seems to be a lull...
Arrived in Paris, 6:55am. Checked in to L’hotel Petit Madeline 8:00am.
Every once in a while it helps to step back and take a look at the big picture. For me, attending events like this week’s 2010 Medical Electronics Symposium, co-hosted by MEPTEC and SMTA, is one way to do that. This year’s theme was Successful Strategies for the Medical Electronics...
Headquartered in Phoenix, AZ, 3D InCites is a member-centric content platform created to support the semiconductor manufacturing supply chain. With a technical focus on advanced packaging, 3D and chiplet integration, we are your go-to resource for all things heterogeneous integration (HI). As a community, 3D InCites brings to life the...
