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Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth sharing from the month previous. If we missed you this month, be sure to add us to your distribution list, we don’t want to leave anyone out. Our community members...
China consumes more than 50% of all semiconductors annually. However, with a rapidly growing consumer market, domestic Chinese manufacturers can meet only around 30% of their own demand. A statistical report from China Electronic Production Equipment Industry Association (CEPEA) shows that the domestic market self-sufficiency rate of integrated circuit equipment...
It’s December, and a busy three weeks of conferences until most of the semiconductor industry takes a short, two-week respite, or at least slow down, while Christmas, New Year’s, and other holidays are celebrated across the globe. Historically, for me the next two weeks have been one of my favorite...
LITHOSCALE® incorporates EVG’s MLE™ (Maskless Exposure) technology to bring the benefits of digital lithography to a wide range of applications and markets EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the LITHOSCALE® maskless exposure system – the...
Smoltek has presented new and improved electrical data for CNF-MIM at EDAPS in Taiwan. The focal point has been on lowering the ESR value that we presented in September. Today Tuesday, December 17, Smoltek has presented the latest advances of the CNF-MIM technology concept. Now we can show a significant...
We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out the latest supplier offerings to support technology trends, and to spread the word about our new community membership opportunities on 3D InCites. But I’ll get to that part in a...
“The die-attach equipment market is showing a 6% CAGR between 2018 and 2024”, announces Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea. “This industry will reach US$1.3 billion by 2024, fueled by the assembly and packaging opportunities created by semiconductor megatrends.” The latest semiconductor manufacturing report...
Rolla, Missouri – Sept. 4, 2018 – Brewer Science, Inc. today from SEMICON Taiwan introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address...
SEMI today announced the appointment of Masahiko (Jim) Hamajima as president of SEMI Japan. Reporting to SEMI president and CEO Ajit Manocha, Hamajima assumes profit and loss (P&L) responsibility for SEMI Japan and leadership of SEMICON Japan along with all regional programs, events, and initiatives including SEMI Standards and industry...
That’s great it starts with an earthquake … R.E.M. Boxing Day 2017 ended with an earthquake in Silicon Valley, at 10:32 pm, a magnitude 3.9 temblor near Alum Rock I thought could have been my neighbor dropping something heavy in the apartment upstairs, except that nobody lifts and drops anything...
